公开(公告)号：US20190169733A1

公开(公告)日：2019-06-06

申请号：US16267798

申请日：2019-02-05

Applicant: Dai Nippon Printing Co., Ltd.

Inventor： Chikao IKENAGA ,  Yo SHIMAZAKI ,  Kentarou SEKI ,  Hiroki FURUSHOU ,  Chiaki HATSUTA

IPC: C23C14/04 ,  G03F7/00 ,  C23F1/02 ,  C25D1/08 ,  H01L51/50 ,  H05B33/10

Abstract: A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y≥950 and y≥23x−1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa).

公开(公告)号：US20180334740A1

公开(公告)日：2018-11-22

申请号：US15763595

申请日：2016-09-29

Applicant: Dai Nippon Printing co., Ltd.

Inventor： Chikao IKENAGA ,  Yo SHIMAZAKI ,  Kentarou SEKI ,  Hiroki FURUSHOU ,  Chiaki HATSUTA

IPC: C23C14/04 ,  C25D1/08

Abstract: A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y≥950 and y≥23x−1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa).

公开(公告)号：US20240049384A1

公开(公告)日：2024-02-08

申请号：US18381789

申请日：2023-10-19

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Hiroki FURUSHOU ,  Atsuko CHIGIRA ,  Toshio SASAO ,  Hiroshi MAWATARI

IPC: H05K1/02 ,  B32B15/04 ,  H01L23/40 ,  H05K3/38

CPC classification number: H05K1/0298 ,  B32B15/04 ,  H01L23/40 ,  H05K3/38

Abstract: A wiring board is disclosed. The wiring board includes a substrate including a first element, a diffusion layer in contact with the substrate and including a first metal element, and a first metal film in contact with the diffusion layer and including a second metal element. The diffusion layer has at least a region including the first element and the first metal element and a region including the first metal element and the second metal element. A concentration of the second metal element in the diffusion layer may decrease as it approaches the substrate in a depth direction. A concentration of the first element in the diffusion layer may decrease as it approaches the first metal film in the depth direction.

公开(公告)号：US20250016927A1

公开(公告)日：2025-01-09

申请号：US18708255

申请日：2022-11-08

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Hiroki FURUSHOU ,  Seiji TAKE ,  Kazuki KINOSHITA ,  Masashi SAKAKI

IPC: H05K1/18 ,  G02F1/1345 ,  H01Q1/22 ,  H10K59/131

Abstract: A module includes a wiring board that has a substrate and a mesh wiring layer and a power supply unit and a protective layer, and a power supply line that is electrically connected to the power supply unit via an anisotropic conductive film containing conductive particles. The substrate has transparency. The protective layer covers only part of the power supply unit. The anisotropic conductive film covers a region of the power supply unit that is not covered by the protective layer.