PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL COMPONENT
    4.
    发明申请
    PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL COMPONENT 审中-公开
    光敏树脂组合物,固化产品和光学组分

    公开(公告)号:US20150018447A1

    公开(公告)日:2015-01-15

    申请号:US14385056

    申请日:2013-03-12

    Abstract: Provided is a photosensitive resin composition that is, after being applied to an adherend surface, rapidly cured by photoirradiation to form a cured product having excellent light-shielding ability and adhesiveness (preferably, further having excellent reflow heat resistance). The photosensitive resin composition includes components (A), (C), and (D) and preferably further includes a component (B) as follows: (A) a cationically polymerizable compound at least including a compound containing an alicyclic epoxy group and devoid of ester bonds; (B) a hydroxyl-containing compound having a molecular weight of 500 or more; (C) a photo-cationic polymerization initiator; and (D) a light-shielding material.

    Abstract translation: 提供一种感光性树脂组合物,其被涂布在被粘物表面之后,通过光照射快速固化,形成具有优异的遮光能力和粘合性(优选进一步具有优异的回流耐热性)的固化产物。 感光性树脂组合物含有(A)成分,(C)成分和(D)成分,优选还含有下述成分(B):(A)至少含有脂环式环氧基的化合物, 酯键; (B)分子量为500以上的含羟基化合物; (C)光阳离子聚合引发剂; 和(D)遮光材料。

    Optical Device, Optical Module, and Method for Manufacturing Optical Device or Optical Module

    公开(公告)号:US20240176049A1

    公开(公告)日:2024-05-30

    申请号:US18283768

    申请日:2022-03-16

    CPC classification number: G02B3/0006 G02B3/0031 H01S5/02253

    Abstract: A technology with a simpler and smaller configuration and capable of suppressing light leakage from an optical module is provided. An optical device (3) includes an optical region (3a) in which an optical element is arranged, at a part of at least one surface of a substrate portion (3b) having a flat plate shape. A peripheral region (3d) in which an optical function as an optical device is not used is provided around the optical region (3a) at the surface, of the substrate portion (3b), provided with the optical region (3a). A light-blocking and diffusing portion (3e) configured to suppress transmission of light or diffuse light is formed at the peripheral region (3d) or a region corresponding to the peripheral region (3d) at an opposite surface of the substrate portion (3b).

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