公开(公告)号：US3786004A

公开(公告)日：1974-01-15

申请号：US19289371

申请日：1971-10-27

申请人： DAINIPPON TORYO KK ,  LEBEN UTILITY CO ,  TOYO BOSEKI

发明人： FURUYA A ,  HACHIBOSHI M ,  ADACHI T ,  UCHIDA M

IPC分类号： C08F259/04 ,  C08J9/12 ,  C08L27/06 ,  C08L67/06 ,  C08K3/22 ,  C08J1/20 ,  C08J1/22

CPC分类号： C08L27/06 ,  C08F259/04 ,  C08J9/122 ,  C08L67/06 ,  C08L2666/14 ,  C08L2666/02

摘要： A THERMOSETTING RESINOUS COMPOSITION COMPRISING A VINYL CHLORIDE RESIN, AN UNSATURATED POLYESTER RESIN, A POLYMERIZATION INITIATOR, A REACTIVE PLASTICIZER AND A MEMBER SELECTED FROM THE GROUP CONSISTING OF THE COMPOUNDS OF ALKALI METALS OF GROUP I IN THE PERIODIC TABLE, THE COMPOUNDS OF ELEMENTS OF GROUP II IN THE PERIODIC TABLE AND THE COMPOUNDS OF LEAD, OPTIONALLY TOGETHER WITH A NONREACTIVE PLASTICIZED AND/OR A VINYL MONOMER, AND A THERMOSETTING RESINOUS COMPOSITION OBTAINED BY INCORPORATING A BUBBLING MATERIAL INTO THE ABOVE COMPOSITION.

公开(公告)号：US3856885A

公开(公告)日：1974-12-24

申请号：US30099872

申请日：1972-10-26

申请人： DAINIPPON TORYO KK ,  LEBEN UTILITY CO

发明人： FURUYA A ,  ISHIMARU Y

IPC分类号： C08G63/52 ,  C08L67/06 ,  C08F21/00

CPC分类号： C08G63/52 ,  C08L67/06 ,  C08L27/04

摘要： This invention relates to a process for molding a thermosetting resinous composition, which comprises heating a liquid composition comprising an unsaturated alkyd resin, a vinyl chloride resin, a vinyl monomer and/or a reactive plasticizer, and a polymerization initiator at a temperature ranging from 80* to 160*C. to such an extent that the composition is not completely cured, cooling the composition to obtain a non-tacky partially-cured composition of a suitable form, and heating said partially-cured composition at a temperature ranging from 120* to 180*C. to complete the curing.

摘要翻译： 本发明涉及一种热固性树脂组合物成型方法，该方法包括在80℃的温度范围内加热包含不饱和醇酸树脂，氯乙烯树脂，乙烯基单体和/或反应性增塑剂的液体组合物和聚合引发剂 DEG至160℃至组合物未完全固化的程度，冷却组合物以获得合适形式的非粘性部分固化组合物，并在120℃的温度范围加热所述部分固化的组合物 至180℃以完成固化。