Method of manufacturing an in-plane metal microneedle array

    公开(公告)号:US11951271B2

    公开(公告)日:2024-04-09

    申请号:US16960177

    申请日:2019-05-13

    CPC classification number: A61M37/0015 B23P17/04 A61M2037/0053 Y10T29/49995

    Abstract: A high aspect ratio in-plane metal microneedle array, a manufacturing method and a clamping and inserting auxiliary device thereof is disclosed. A large-size metal sheet is cut into small metal sheets. A clamping tooling composed of two upper and lower metal cover plates is processed. Inner sides of the upper and the lower cover plates of the tooling are provided with grooves in which the metal sheets are placed and fastened by bolts. Wire cutting is conducted on the tooling and the metal sheets as a whole to obtain a plane metal microneedle array with a plurality of microneedle bodies. In addition, an assembling and clamping device and an inserting auxiliary device of the high aspect ratio in-plane metal microneedle array is provided. The assembled inserting auxiliary device is placed on skin, and the microneedle array is inserted into the skin through the auxiliary device.

    In-plane metal microneedle array and manufacturing method therefor

    公开(公告)号:US11738185B2

    公开(公告)日:2023-08-29

    申请号:US16960169

    申请日:2019-05-13

    CPC classification number: A61M37/0015 B21G1/003 A61M2037/0053

    Abstract: An in-plane metal microneedle array and a manufacturing method therefor is disclosed. A large-size metal sheet is cut into small metal sheets. Inner sides of the upper and the lower cover plates of the tooling are provided with grooves matched with the sizes of the small metal sheets. Through holes are formed at edges around the cover plates. The metal sheets are placed in the grooves and fastened through bolts. The geometry and the size of a sheet microneedle array are designed, and a CAD model of the plane microneedles is built. A wire path is cut according to the CAD model. A few materials are reserved on both sides of substrates of the microneedle array without cutting. The unprocessed parts on both sides of the microneedle substrate are cut to obtain an in-plane metal microneedle array with a plurality of microneedle bodies.

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