Helical Milling Tool with Forward-Backward Feeding

    公开(公告)号:US20210362248A1

    公开(公告)日:2021-11-25

    申请号:US17053044

    申请日:2018-05-04

    Abstract: Disclosed is a helical milling tool with forward-backward feeding, the tool including a cutting portion, a neck portion and a handle portion, which are successively connected to each other; wherein the cutting portion includes a front-end cutting section, a circumferential cutting section and a back-end cutting section, which are connected successively to each other; the front-end cutting section is of an end milling cutter structure or a drill bit structure; the circumferential cutting section is of a cylindrical shape and is of a circumferential milling cutter structure; and the back-end cutting section is of a frustum-shaped. The tool can avoid defects such as layering and tearing, which go beyond processing requirements in a composite material, improve the processing quality, save on costs, simplify the processing process, improve the production efficiency and prolong the service life of the tool.

    ULTRASONIC CUTTING METHOD EMPLOYING STRAIGHT-BLADE SHARP KNIFE AND APPLICATION THEREOF

    公开(公告)号:US20210031393A1

    公开(公告)日:2021-02-04

    申请号:US16968124

    申请日:2019-02-02

    Abstract: Disclosed is an ultrasonic cutting method employing a straight-blade sharp knife. The ultrasonic cutting method employing the straight-blade sharp knife includes the following steps: S1, measuring parameters of the straight-blade sharp knife; S2, initially rotating, by the straight-blade sharp knife, around an axis thereof, such that a rear knife surface of the straight-blade sharp knife is attached to or is away from a machined surface, and performing ultrasonic vibration cutting on a material according to a machining track; S3, performing quality detection on the machined material surface obtained by the ultrasonic vibration cutting, completing the machining if the surface passes the detection, and performing step S4 if the surface does not pass the detection; S4, further increasing an amount of rotation of the straight-blade sharp knife during initial rotation around the axis thereof, performing the ultrasonic vibration cutting on the material according to the machining track, and performing step S3.

    METHOD AND DEVICE FOR MEASURING SURFACE SHAPE OF HONEYCOMB CORE

    公开(公告)号:US20200072600A1

    公开(公告)日:2020-03-05

    申请号:US16319760

    申请日:2017-07-03

    Abstract: A method for measuring a surface shape of a honeycomb core includes the following steps: coating a reflective film on the surface of the honeycomb core to be measured, using a vacuum adsorption method to adhere the reflective film closely to the surface of the honeycomb core to be measured, and recessing the reflective film at a honeycomb cell downwards; and performing scanning measurement on the reflective film on the surface of the honeycomb core to be measured to obtain the heights of a honeycomb wall of the honeycomb core at different spatial positions. A device carries out the measurement of the surface shape of a honeycomb core.

    COMBINED GRINDING WHEEL FOR ULTRASONIC MACHINING AND DESIGN METHOD THEREFOR

    公开(公告)号:US20220324076A1

    公开(公告)日:2022-10-13

    申请号:US17597678

    申请日:2019-08-29

    Abstract: A combined grinding wheel for ultrasonic machining and the determine method thereof. The combined grinding wheel for ultrasonic machining comprises: an outer grinding ring, an upper end thereof having a center taper hole and a plurality of outer grinding ring water holes located in a circumferential outer side of the center taper hole; a connecting taper shank, the upper end thereof having a taper shank extending into an outer grinding ring cavity from the center taper hole and matching the tapered surface of the center taper hole; a connecting flange, located outside the shank portion and fixed on the inner wall of the upper end of the outer grinding ring cavity, and having a center tapered through hole; and an inner vibration unit, having a tapered surface matching the tapered surface of the center tapered through hole and a center hole connected with the connecting taper shank by means of a screw.

    SEMICONDUCTOR WAFER PHOTOELECTROCHEMICAL MECHANICAL POLISHING PROCESSING DEVICE AND PROCESSING METHOD

    公开(公告)号:US20220088740A1

    公开(公告)日:2022-03-24

    申请号:US17413939

    申请日:2019-12-13

    Abstract: A semiconductor wafer is adhered and fixed to a polishing head by means of a conductive adhesive, and the wafer is connected to a positive electrode of an external power supply through wires of the inner and outer rings of a conductive slip ring below the wafer. A polishing pad is adhered to the bottom of a counter electrode disc, the counter electrode disc is fixed at the bottom of a polishing disc and is processed with through holes at the position corresponding to the polishing disc, and the counter electrode disc is connected to a negative electrode of the external power supply through the wires of inner and outer rings of a conductive slip ring above the counter electrode disc. Ultraviolet light emitted by an ultraviolet light source can reach the surface of the wafer through the through holes, and a polishing solution can be sprayed through the through holes into a contact area between the wafer and the polishing pad.

    Ultrasonic Cutting Holder For Honeycomb Core

    公开(公告)号:US20210268679A1

    公开(公告)日:2021-09-02

    申请号:US16968122

    申请日:2019-02-02

    Abstract: The present disclosure discloses an ultrasonic cutting holder for a honeycomb core, including a holder, a swing mechanism, a transducer, a first-stage amplitude transformer, a second-stage amplitude transformer, an ultrasonic cutting tool, and an ultrasonic power transmission mechanism. The present disclosure provides an ultrasonic cutting holder for a honeycomb core with large amplitude output capacity and considering the interchangeability requirements among different vibration systems, which solves the problem of the applicability of ultrasonic cutting holder on the universal machine tool and improves the automation level of ultrasonic cutting.

    AUTOMATIC HOLE-PROCESSING METHOD WITH SELF-ADAPTING ADJUSTMENT OF PROCESSING PARAMETERS

    公开(公告)号:US20210229188A1

    公开(公告)日:2021-07-29

    申请号:US17214750

    申请日:2021-03-26

    Abstract: Disclosed is an automatic hole-processing method with self-adapting adjustment of processing parameters, including the following steps: performing tool feeding, detecting whether the rotate speed changes or not, if changes, judging the type of the processing material according to the new rotate speed after stabilization (if not, the tool feeding is continued); feeding the tool according to the processing parameters suitable for the material, detecting whether the rotate speed changes or not, if changes, judging whether the hole processing has been completed or not according to the new rotate speed after stabilization (if not, the tool feeding is continued), if completed, retracting the tool with the set parameters (if not, judging the type of the processing material according to the new rotate speed after stabilization, and repeating the above steps), completing the hole processing. During the hole processing in the present disclosure, there is no need to know the type of workpiece material of each processing hole in advance and to set processing parameters for each material respectively; there is no need for axial tool setting, processing parameters can be changed automatically after the tool contacts the workpiece; there is no need to know the total thickness of each processing hole material in advance and to set the feed stokes respectively, after cutting through the workpiece, the tool automatically identifies and begins to retract.

    ULTRASONIC CUTTER DETECTION METHOD AND DEVICE

    公开(公告)号:US20190331645A1

    公开(公告)日:2019-10-31

    申请号:US16467376

    申请日:2017-07-03

    Abstract: An ultrasonic cutter detection method and device, the method comprises the following steps: preliminary detection: frequency amplitude detection and fall-of-potential detection, if the ultrasonic cutter fails the above two detection solutions in the preliminary detection, repeating the two detections; if the ultrasonic cutter still fails the above two detection solutions, the ultrasonic cutter is judged to be unqualified; and reinspection: free modal detection and pressure modal detection. Using differences of the ultrasonic cutters surface in micro-crack directions that result in different degrees of sensitivity of crack to different ultrasonic vibration modes, combined with the fall-of-potential method and frequency amplitude detection method, a detection rate and a detection velocity of an unqualified ultrasonic cutter can be improved.

Patent Agency Ranking