公开(公告)号：US11820922B2

公开(公告)日：2023-11-21

申请号：US16649361

申请日：2018-10-02

申请人： DDP SPECIALTY ELECTRONIC MATERIALS US, LLC

发明人： Tyler Auvil ,  Gary L. Jialanella ,  Eric E. Cole ,  Felix Koch ,  Andreas Lutz ,  Daniel Schneider

IPC分类号： C08L63/00 ,  C09J163/00 ,  C08G59/40 ,  C09J5/06 ,  C09J11/04

CPC分类号： C09J163/00 ,  C08G59/4021 ,  C08L63/00 ,  C09J5/06 ,  C09J11/04 ,  C09J2463/00

摘要： An epoxy-based crash durable adhesive composition including: (I) a liquid resin system comprising: (a) at least one epoxy resin; and (b) at least one toughener; wherein the viscosity of the above liquid resin system is less than about 800 Pa s at a temperature of 15° C.; and wherein the viscosity of the above liquid resin system is greater than about 5 Pa-s at a temperature of 60° C.; (II) a solid material comprising: (c) at least one hydrophobic fumed silica, wherein the fumed silica is present in the adhesive composition at a concentration of greater than 5 weight percent; and (III) a curative material comprising: (d) at least one latent heat-activated curing agent; wherein the rheology of the epoxy-based crash durable adhesive composition is such that the adhesive composition is pumpable at a temperature of 15° C. or greater; and wherein the epoxy-based crash durable adhesive composition exhibits an increase in wash-off resistance; a process for making the above adhesive composition; and a process for bonding metal substrates together with the above adhesive composition.