Thin vapor-chamber structure
    1.
    发明授权

    公开(公告)号:US11835299B2

    公开(公告)日:2023-12-05

    申请号:US17326079

    申请日:2021-05-20

    CPC classification number: F28D15/04

    Abstract: The disclosure relates to a thin vapor-chamber structure including a first cover and a second cover. The first cover has a first surface and a first clustered pattern. The first clustered pattern is disposed on the first surface, and has a plurality of first protruding stripes spaced apart from each other and extended along a first direction. The second cover has a second surface and a second clustered pattern. The first surface faces the second surface. The second clustered pattern is disposed on the second surface, and has a plurality of second protruding stripes spaced apart from each other and extended along a second direction. The first clustered pattern and the second clustered pattern are partially contacted with each other to form a wick. The lateral walls of the first protruding stripes and the second protruding stripes form a micro-channel meandering between the first surface and the second surface.

    Heat dissipation assembly
    2.
    发明授权

    公开(公告)号:US12185494B2

    公开(公告)日:2024-12-31

    申请号:US17982260

    申请日:2022-11-07

    Abstract: A heat dissipation assembly is disclosed and includes a fan, a vapor chamber and a heat dissipation fin set. The fan includes a fan frame, an impeller and a fan cover. The impeller is disposed on the fan frame and accommodated in an accommodation space. The impeller includes plural metal blades and a hub, and the plural metal blades are radially arranged on the periphery of the hub to form a dense-metal-blade impeller. The fan cover is assembled with the fan frame to form an outlet, and the fan cover includes an inlet. The vapor chamber includes an upper plate and a lower plate assembled with each other. The upper plate or the lower plate is connected to the fan cover, and the vapor chamber and the fan cover are coplanar. The heat dissipation fin set is connected to the lower plate and spatially corresponding to the outlet.

    THIN VAPOR-CHAMBER STRUCTURE
    3.
    发明申请

    公开(公告)号:US20220003507A1

    公开(公告)日:2022-01-06

    申请号:US17326079

    申请日:2021-05-20

    Abstract: The disclosure relates to a thin vapor-chamber structure including a first cover and a second cover. The first cover has a first surface and a first clustered pattern. The first clustered pattern is disposed on the first surface, and has a plurality of first protruding stripes spaced apart from each other and extended along a first direction. The second cover has a second surface and a second clustered pattern. The first surface faces the second surface. The second clustered pattern is disposed on the second surface, and has a plurality of second protruding stripes spaced apart from each other and extended along a second direction. The first clustered pattern and the second clustered pattern are partially contacted with each other to form a wick. The lateral walls of the first protruding stripes and the second protruding stripes form a micro-channel meandering between the first surface and the second surface.

    HEAT DISSIPATION ASSEMBLY
    4.
    发明申请

    公开(公告)号:US20250071935A1

    公开(公告)日:2025-02-27

    申请号:US18945399

    申请日:2024-11-12

    Abstract: A heat dissipation assembly is disclosed and includes a fan, a vapor chamber and a heat dissipation fin set. The fan includes a fan frame, an impeller and a fan cover. The impeller is disposed on the fan frame and accommodated in an accommodation space. The impeller includes plural metal blades and a hub, and the plural metal blades are radially arranged on the periphery of the hub to form a dense-metal-blade impeller. The fan cover is assembled with the fan frame to form an outlet, and the fan cover includes an inlet. The vapor chamber includes an upper plate and a lower plate assembled with each other. The upper plate or the lower plate is connected to the fan cover, and the vapor chamber and the fan cover are coplanar. The heat dissipation fin set is connected to the lower plate and spatially corresponding to the outlet.

    Auxiliary power circuit, balance circuit, and power supply system

    公开(公告)号:US12062988B2

    公开(公告)日:2024-08-13

    申请号:US17735772

    申请日:2022-05-03

    CPC classification number: H02M3/3353 H02M1/0058 H02M3/33592

    Abstract: An auxiliary power circuit of a conversion module is used to supply power to a control unit, and an input end of the conversion module includes an even number of energy storage units coupled in series. The auxiliary power circuit includes an even number of primary-side circuits and a secondary-side circuit. Each primary-side circuit includes a first switch unit, a second switch unit, and a resonance tank. The first switch unit is connected to the second switch unit in series, and is correspondingly connected to one of the energy storage units in parallel. The resonance tank is connected to the second switch unit in parallel. The secondary-side circuit is coupled to the resonance tanks of two of the primary-side circuits to acquire power and supply power to the control unit.

    HEAT DISSIPATION ASSEMBLY
    6.
    发明公开

    公开(公告)号:US20240032236A1

    公开(公告)日:2024-01-25

    申请号:US17982260

    申请日:2022-11-07

    CPC classification number: H05K7/20136 H05K7/2039 G06F1/203

    Abstract: A heat dissipation assembly is disclosed and includes a fan, a vapor chamber and a heat dissipation fin set. The fan includes a fan frame, an impeller and a fan cover. The impeller is disposed on the fan frame and accommodated in an accommodation space. The impeller includes plural metal blades and a hub, and the plural metal blades are radially arranged on the periphery of the hub to form a dense-metal-blade impeller. The fan cover is assembled with the fan frame to form an outlet, and the fan cover includes an inlet. The vapor chamber includes an upper plate and a lower plate assembled with each other. The upper plate or the lower plate is connected to the fan cover, and the vapor chamber and the fan cover are coplanar. The heat dissipation fin set is connected to the lower plate and spatially corresponding to the outlet.

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