公开(公告)号：US20210032171A1

公开(公告)日：2021-02-04

申请号：US16766954

申请日：2018-12-05

Applicant: DENKA COMPANY LIMITED

Inventor： Yoshitaka MINAKATA ,  Eri SASAKI ,  Toshitaka YAMAGATA ,  Saori INOUE ,  Ryo YOSHIMATU ,  Ryuji KOGA

IPC: C04B41/48 ,  C08G59/24 ,  H05K1/03 ,  H05K3/38 ,  C09J163/00 ,  C04B38/00 ,  C04B41/82

Abstract: A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.

公开(公告)号：US20220194870A1

公开(公告)日：2022-06-23

申请号：US17441756

申请日：2020-03-25

Applicant: Denka Company Limited

Inventor： Yoshitaka MINAKATA ,  Eri SASAKI ,  Saori INOUE ,  Mana OKI

IPC: C04B41/83 ,  C04B22/00 ,  C04B35/58 ,  C04B41/89

Abstract: The present disclosure provides a composite including a nitride sintered body having a porous structure and a semi-cured product of a heat-curable composition impregnated into the nitride sintered body, wherein a dielectric breakdown voltage obtainable after disposing the composite between adherends, heating and pressurizing the composite for 5 minutes under the conditions of 200° C. and 10 MPa, and further heating the composite for 2 hours under the conditions of 200° C. and atmospheric pressure, is greater than 5 kV.