公开(公告)号：US20210130689A1

公开(公告)日：2021-05-06

申请号：US17041920

申请日：2019-03-14

Applicant: DENKA COMPANY LIMITED

Inventor： Masato AKABANE ,  Ryo YOSHIMATU ,  Hiroaki TOYOSHIMA ,  Motoi TANAKA

IPC: C09K11/77 ,  C09K11/08 ,  C01B21/082 ,  H01L33/50

Abstract: A phosphor including a fired product having a composition represented by general formula M1aM2bM3cAl3N4-dOd, wherein M1 is one or more elements selected from Sr, Mg, Ca, and Ba, M2 is one or more elements selected from Li, Na, and K, and M3 is one or more elements selected from Eu, Ce, and Mn, and wherein a, b, c, and d satisfy each of the following formulas: 0.850≤a≤1.150, 0.850≤b≤1.150, 0.001≤c≤0.010, 0.10

公开(公告)号：US20210032171A1

公开(公告)日：2021-02-04

申请号：US16766954

申请日：2018-12-05

Applicant: DENKA COMPANY LIMITED

Inventor： Yoshitaka MINAKATA ,  Eri SASAKI ,  Toshitaka YAMAGATA ,  Saori INOUE ,  Ryo YOSHIMATU ,  Ryuji KOGA

IPC: C04B41/48 ,  C08G59/24 ,  H05K1/03 ,  H05K3/38 ,  C09J163/00 ,  C04B38/00 ,  C04B41/82

Abstract: A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.