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公开(公告)号：US20230271888A1
公开(公告)日：2023-08-31
申请号：US17998687
申请日：2021-05-13
Applicant: Denka Company Limited
Inventor： Nobuya SUZUKI , Saori INOUE , Yasuhisa UESHIMA , Ryo YOSHIMATSU , Ryuji KOGA
CPC classification number: C04B41/4884 , B29C39/10 , C04B35/583 , C04B41/0063 , C04B41/83 , C04B41/4521 , C04B41/4525 , H01L33/641
Abstract: One aspect of the present disclosure provides a production method for a composite, the method including: a cooling step of performing cooling under a pressurized condition in a state where a heated molten material of a thermosetting composition is brought into contact with a resin-impregnated body, in which the above-described resin-impregnated body includes a nitride sintered body having a porous structure and a semi-cured product of the thermosetting composition impregnated into the above-described nitride sintered body.
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公开(公告)号：US20220177375A1
公开(公告)日：2022-06-09
申请号：US17441763
申请日：2020-03-26
Applicant: Denka Company Limited
Inventor： Saori INOUE , Shoji IWAKIRI , Yoshitaka MINAKATA , Ryo YOSHIMATSU , Ryuji KOGA , Tomoya YAMAGUCHI
IPC: C04B35/583 , C04B41/83
Abstract: One aspect of the present invention is a composite including: a porous boron nitride sintered body; and a resin filled in pores of the boron nitride sintered body, wherein the boron nitride sintered body has an average pore diameter of 3.5 μm or less.
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Patent Agency Ranking
公开(公告)号：US20200031723A1
公开(公告)日：2020-01-30
申请号：US16498648
申请日：2018-03-28
Applicant: DENKA COMPANY LIMITED
Inventor： Saori INOUE , Toshitaka YAMAGATA , Yoshitaka MINAKATA , Ryo YOSHIMATSU , Ryuji KOGA
IPC: C04B35/583 , C04B41/83 , H01L23/373 , H01L23/34
Abstract: A thermal conductive member includes: first and second surface layers including an insulating material A, and an intermediate layer including an insulating material B. The insulating material A includes a first boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.6 to 1.4, and a first heat curable resin composition impregnating in the first boron nitride sintered body. The insulating material B includes a second boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.01 to 0.05, and a second heat curable resin composition impregnating in the second boron nitride sintered body.
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公开(公告)号：US20230227370A1
公开(公告)日：2023-07-20
申请号：US17998690
申请日：2021-05-13
Applicant: Denka Company Limited
Inventor： Nobuya SUZUKI , Saori INOUE , Yasuhisa UESHIMA , Ryo YOSHIMATSU , Ryuji KOGA
CPC classification number: C04B37/021 , C04B35/583 , C04B41/83 , C04B41/4884 , B32B3/26 , B32B9/005 , B32B9/041 , C04B2237/361 , C04B2237/407 , C04B2237/52 , H01L33/641
Abstract: One aspect of the present disclosure provides a composite body including: a nitride sintered body having a porous structure; and a semi-cured product of a thermosetting composition impregnated into the above-described nitride sintered body, in which dielectric breakdown voltage is 4.5 kV or higher.
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公开(公告)号：US20210032171A1
公开(公告)日：2021-02-04
申请号：US16766954
申请日：2018-12-05
Applicant: DENKA COMPANY LIMITED
Inventor： Yoshitaka MINAKATA , Eri SASAKI , Toshitaka YAMAGATA , Saori INOUE , Ryo YOSHIMATU , Ryuji KOGA
Abstract: A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.
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公开(公告)号：US20220250994A1
公开(公告)日：2022-08-11
申请号：US17441746
申请日：2020-03-26
Applicant: Denka Company Limited
Inventor： Saori INOUE , Shoji IWAKIRI , Yoshitaka MINAKATA , Ryo YOSHIMATSU , Ryuji KOGA , Tomoya YAMAGUCHI
IPC: C04B41/48 , C04B35/583 , C04B38/00
Abstract: One aspect of the present invention is a method for producing a composite, including a step of placing a porous boron nitride sintered body immersed in a resin composition under a pressurized condition and then placing the boron nitride sintered body immersed in the resin composition under a pressure condition lower than the pressurized condition, wherein the step is repeated a plurality of times.
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公开(公告)号：US20190189534A1
公开(公告)日：2019-06-20
申请号：US16322570
申请日：2017-08-02
Applicant: Denka Company Limited
Inventor： Toshitaka YAMAGATA , Saori INOUE , Hideki HIROTSURU , Ryoh YOSHIMATU , Ryuji KOGA
IPC: H01L23/373
CPC classification number: H01L23/3733 , H01L23/3731 , H01L23/3737 , H01L23/4006 , H01L23/473
Abstract: Provided is a heat dissipation structure for an electric circuit device excellent in mass-productivity and heat radiation performance. A heat dissipation structure for an electric circuit device, the structure including a layered structure comprising: a heatsink exposed on the electric circuit device; a thermal conductive member; and a cooler, wherein the thermal conductive member is a ceramic-resin composite in which a resin composition is impregnated in a ceramic sintered body, the ceramic sintered body comprising ceramic primary particles integrated into a three-dimensional structure, and wherein the thermal conductive member is arranged such that the thermal conductive member directly contacts with at least one of the heatsink and the cooler.
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