公开(公告)号：US20200373251A1

公开(公告)日：2020-11-26

申请号：US16636184

申请日：2018-07-30

Applicant: DENKA COMPANY LIMITED

Inventor： Hideki HIROTSURU ,  Yoshitaka TANIGUCHI ,  Kohki ICHIKAWA ,  Atsushi SAKAI

IPC: H01L23/00 ,  H01L23/15 ,  H01L25/07

Abstract: A power module includes a base plate, a ceramic insulating substrate bonded on the base plate, and a semiconductor element bonded on the ceramic insulating substrate, wherein a surface of the base plate on a side opposite to the ceramic insulating substrate has a warp with a convex shape, and a linear thermal expansion coefficient α1 (×10−6/K) of the base plate and a linear thermal expansion coefficient α2 (×10−6/K) of the ceramic insulating substrate when a temperature decreases in the range of 25° C. to 150° C. satisfy the following Expression (1).  α   1 - α   2  ( α   1 + α   2 )  /  2 × 100 ≤ 10 ( 1 )

公开(公告)号：US20220073698A1

公开(公告)日：2022-03-10

申请号：US17423256

申请日：2020-01-28

Applicant: Denka Company Limited

Inventor： Yusuke SASAKI ,  Fumihiro KUROKAWA ,  Kohki ICHIKAWA

IPC: C08K3/38 ,  C01B21/064 ,  C08G59/40 ,  C08G59/20 ,  C08K7/18

Abstract: One aspect of the present invention is a boron nitride powder composed of aggregates of primary particles of boron nitride, wherein the boron nitride powder has an average diameter of 40 μm or more and an average sphericity of less than 0.70.

公开(公告)号：US20200375029A1

公开(公告)日：2020-11-26

申请号：US16636239

申请日：2018-07-30

Applicant: DENKA COMPANY LIMITED

Inventor： Atsushi SAKAI ,  Hideki HIROTSURU ,  Kohki ICHIKAWA ,  Yoshitaka TANIGUCHI

IPC: H05K1/03 ,  H05K1/05

Abstract: A ceramic circuit board includes a ceramic substrate and metal layers provided to both surfaces of the ceramic substrate and containing Al and/or Cu, wherein a measurement value α1 of a linear thermal expansion coefficient at 25° C. to 150° C. is 5×10−6 to 9×10−6/K, a ratio α1/α2 of the α1 to a theoretical value α2 of the linear thermal expansion coefficient at 25° C. to 150° C. is 0.7 to 0.95, and at least one of the metal layers forms a metal circuit.

公开(公告)号：US20200181414A1

公开(公告)日：2020-06-11

申请号：US16500042

申请日：2018-03-30

Applicant: DENKA COMPANY LIMITED

Inventor： Shuji SASAKI ,  Yuzo NAKAMURA ,  Kohki ICHIKAWA

IPC: C09C1/00 ,  C08K3/22 ,  C08K3/36 ,  C08K7/18 ,  H01L23/29

Abstract: A powder mixture including spherical barium titanate particles and spherical oxide particles and having an average particle diameter of 2 μm or more and 30 μm or less, wherein the spherical oxide particles have an average particle diameter of 0.05 μm or more and 1.5 μm or less, and the spherical oxide particles are contained in an amount of 0.02% by mass or more and 15% by mass or less based on the powder mixture. The spherical oxide particles are preferably amorphous silicon dioxide particles and/or aluminum oxide particles. According to the present invention, it is possible to provide a spherical barium titanate-based powder which enables to prepare a high dielectric resin composition with which reduced wire sweep amount and burr are achieved.