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公开(公告)号:US20250002630A1
公开(公告)日:2025-01-02
申请号:US18710228
申请日:2022-11-10
Applicant: DENKA COMPANY LIMITED
Inventor: Kosuke WADA , Tomoyuki KANAI , Kenji FUKAO , Tatsumi ARAI , Masao ONOZUKA , Takayuki IWASAKI
Abstract: A copolymer contains a (meth)acrylic based monomer unit A having an anionic group, a (meth)acrylic based monomer unit B having a cationic group, and a (meth)acrylic based monomer unit C other than the (meth)acrylic based monomer unit A and the (meth)acrylic based monomer unit B, and the (meth)acrylic based monomer unit C has a weight average molecular weight of 2,000 to 9,000. The surfactant contains the copolymer. The resin composition contains a resin, the surfactant, and an inorganic filler. The heat dissipation sheet contains the resin composition. The present invention can provide a copolymer that is capable of reducing the viscosity of a resin composition containing a resin and an inorganic filler, a surfactant containing the copolymer, a resin composition containing the surfactant and an inorganic filler, and a heat dissipation sheet containing the resin composition.
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公开(公告)号:US20210130653A1
公开(公告)日:2021-05-06
申请号:US16500265
申请日:2018-04-02
Applicant: DENKA COMPANY LIMITED
Inventor: Junpei Fujiwara , Takayuki IWASAKI , Yasushi HIROKAWA
Abstract: [Problem] The present invention is to provide: a film which is excellent in film moldability, is also excellent in heat resistance and transparency, and has a small shrinkage factor and a small heating weight loss ratio even under a high-temperature atmosphere; and a heat-resistant adhesive tape comprising the same.
[Solution] A multilayer film having alternately laminated therein one or more layers of each of a substrate layer (A) comprising a sulfone-based resin having a glass transition temperature of 200° C. or more and an adhesive layer (B) comprising a thermoplastic resin having a glass transition temperature of 190° C. or more, and a multilayer film excellent in film moldability, heat resistance, and transparency is obtained due to at least one outermost layer of the multilayer film comprising the adhesive layer (B) and the arithmetic mean surface roughness Ra of a surface of at least one outermost layer of the multilayer film being greater than 0.1 μm and less than 10.0 μm.
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