公开(公告)号：US20250002771A1

公开(公告)日：2025-01-02

申请号：US18710224

申请日：2022-11-10

Applicant: DENKA COMPANY LIMITED

Inventor： Kosuke WADA ,  Kenji FUKAO ,  Masao ONOZUKA

IPC: C09K5/14 ,  C01B21/064 ,  C08F220/06 ,  C08K3/38 ,  C08L83/04

Abstract: The inorganic filler of the present invention has a zeta potential of −15 mV or less at a pH of 7. The heat dissipation member of the present invention contains the inorganic filler of the present invention and a resin. The present invention can provide an inorganic filler that has good dispersibility in a resin, and a heat dissipation member containing the inorganic filler.

公开(公告)号：US20230374363A1

公开(公告)日：2023-11-23

申请号：US18030210

申请日：2021-10-05

Applicant: Denka Company Limited

Inventor： Kazuyuki IGARASHI ,  Masao ONOZUKA

IPC: C09K5/14 ,  C08L83/04 ,  C08L83/10 ,  C08K3/22 ,  C08K3/38 ,  C08K3/28 ,  H05K7/20

CPC classification number: C09K5/14 ,  C08L83/04 ,  C08L83/10 ,  C08K3/22 ,  C08K3/38 ,  C08K3/28 ,  H05K7/2039 ,  C08L2207/32 ,  C08L2205/025 ,  C08L2205/03 ,  C08K2201/001 ,  C08K2201/014 ,  C08K2003/2227 ,  C08K2003/385 ,  C08K2003/282 ,  C08K2003/222

Abstract: The thermally conductive resin composition containing: 5 to 95 parts by weight of a copolymer (a) having a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B having a cationic group, and a silicone (meth)acrylic monomer unit C; 95 to 5 parts by weight of a silicone resin (b); and 500 to 3000 parts by weight of a thermally conductive filler (c) having a thermal conductivity of 10 W/mK or more, wherein a total content of the copolymer (a) and the silicone resin (b) is 100 parts by weight.

公开(公告)号：US20230374189A1

公开(公告)日：2023-11-23

申请号：US18030253

申请日：2021-10-05

Applicant: Denka Company Limited

Inventor： Kazuyuki IGARASHI ,  Masao ONOZUKA

IPC: C08F290/06 ,  H05K7/20 ,  C08L83/04 ,  C08K9/06

CPC classification number: C08F290/068 ,  H05K7/20463 ,  C08L83/04 ,  C08K9/06 ,  C08K2201/001 ,  C08L2312/00 ,  C08K2201/005

Abstract: The thermally conductive resin composition containing: 5 to 95 parts by weight of a copolymer (a) having a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B having a cationic group, and a silicone (meth)acrylic monomer unit C; 95 to 5 parts by weight of a silicone resin (b); and 500 to 3000 parts by weight of a thermally conductive filler (c) having a thermal conductivity of 10 W/mK or more, wherein a total content of the copolymer (a) and the silicone resin (b) is 100 parts by weight, and the silicone resin (b) includes a crosslinked silicone resin (b-1), wherein a content of the crosslinked silicone resin (b-1) is 5 to 100 mass % based on the total amount of the silicone resin (b).

公开(公告)号：US20230416509A1

公开(公告)日：2023-12-28

申请号：US18251300

申请日：2021-09-17

Applicant: Denka Company Limited

Inventor： Misaki ITO ,  Masao ONOZUKA ,  Masahiro KATO

IPC: C08L11/00 ,  C08F36/18

CPC classification number: C08L11/00 ,  C08F36/18

Abstract: A method for manufacturing a chloroprene polymer composition, the method including: a polymerization step of polymerizing chloroprene in the presence of at least one rosin acid component selected from the group consisting of a rosin acid and a rosin acid salt to obtain a chloroprene polymer composition containing a chloroprene polymer, in which in the rosin acid component, a mass ratio B1/A1 of a total amount B1 of abietic acid, neoabietic acid, palustric acid, levopimaric acid, and salts thereof with respect to a total amount A1 of dehydroabietic acid, pimaric acid, isopimaric acid, dihydroabietic acid, and salts thereof is 0.10 to 3.00, and a toluene insoluble content of the chloroprene polymer is 50% by mass or more.

公开(公告)号：US20190309195A1

公开(公告)日：2019-10-10

申请号：US16315414

申请日：2017-06-29

Applicant: DENKA COMPANY LIMITED

Inventor： Gaito KIYOFUJI ,  Masao ONOZUKA ,  Manabu MIZUSHIMA ,  Shogo HAGIWARA ,  Hironori KONISHI ,  Daisuke SHIMIYA ,  Kazuhiro KOTE

IPC: C09J111/02 ,  C09J11/04 ,  C09J11/06

Abstract: A latex composition gives favorable initial adhesive strength after short drying period, shows storage stability and spray coating characteristics and gives a soft adhesive layer after drying and a one-pack type aqueous adhesive. The latex composition includes a chloroprene-based polymer latex (A) containing a chloroprene-based polymer in an amount of 50 to 85 mass % as solid matter and an acrylic polymer latex (B) having a glass transition temperature of −52 to −9° C. and containing an acrylic polymer containing a sodium alkylbenzenesulfonate having a structure represented by the Chemical Formula (1) in an amount of 15 to 50 mass % as solid matter, in a total amount of 100 parts by mass, and additionally at least one pH regulator (C) selected from boric acid, ammonium sulfate, and amino acids having an isoelectric point of 5.5 to 6.5 in an amount of 3 to 13 parts by mass as solid matter.

公开(公告)号：US20250002630A1

公开(公告)日：2025-01-02

申请号：US18710228

申请日：2022-11-10

Applicant: DENKA COMPANY LIMITED

Inventor： Kosuke WADA ,  Tomoyuki KANAI ,  Kenji FUKAO ,  Tatsumi ARAI ,  Masao ONOZUKA ,  Takayuki IWASAKI

IPC: C08F290/06 ,  C08J5/22 ,  C08K3/38 ,  C08K9/08 ,  C08L63/04 ,  C08L83/04

Abstract: A copolymer contains a (meth)acrylic based monomer unit A having an anionic group, a (meth)acrylic based monomer unit B having a cationic group, and a (meth)acrylic based monomer unit C other than the (meth)acrylic based monomer unit A and the (meth)acrylic based monomer unit B, and the (meth)acrylic based monomer unit C has a weight average molecular weight of 2,000 to 9,000. The surfactant contains the copolymer. The resin composition contains a resin, the surfactant, and an inorganic filler. The heat dissipation sheet contains the resin composition. The present invention can provide a copolymer that is capable of reducing the viscosity of a resin composition containing a resin and an inorganic filler, a surfactant containing the copolymer, a resin composition containing the surfactant and an inorganic filler, and a heat dissipation sheet containing the resin composition.

公开(公告)号：US20220267575A1

公开(公告)日：2022-08-25

申请号：US17623648

申请日：2020-06-30

Applicant: DENKA COMPANY LIMITED

Inventor： Masao ONOZUKA ,  Hidehito OTSUKA

IPC: C08L11/02

Abstract: A chloroprene copolymer latex containing a chloroprene copolymer having a structural unit derived from chloroprene and a structural unit derived from 2,3-dichloro-1,3-butadiene, in which a toluene insoluble content in the chloroprene copolymer is 50 to 95% by mass, and a modulus at 500% elongation of a film, which is obtained on a base material by dipping the base material in the chloroprene copolymer latex and then performing vulcanization at 100° C. for 30 minutes, according to JIS K 6251 is 4.0 MPa or less.