公开(公告)号：US20150366080A1

公开(公告)日：2015-12-17

申请号：US14762899

申请日：2014-01-14

Applicant: DENSO CORPORATION

Inventor： Hirokazu SAITOH ,  Ichiro YOSHIDA

IPC: H05K3/40 ,  H05K3/46 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K3/4038 ,  H05K1/0216 ,  H05K3/0079 ,  H05K3/28 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/46 ,  H05K2201/09072 ,  H05K2201/099 ,  H05K2201/10674 ,  H05K2203/0594 ,  H05K2203/081 ,  H05K2203/1581 ,  Y10T29/49126

Abstract: In a method for manufacturing a multilayer substrate for having a BGA-type component thereon, a conductive through hole for restricting a signal interference and a resist film are formed on the multilayer substrate, an occurrence of a fault caused by a residual of a resist in the conductive through hole is reduced. In the method for manufacturing the multilayer substrate for having the BGA-type component thereon, a step of forming the resist film includes an applying step of applying a photosensitive resist to an entirety of a front surface portion of a base. The applying step is performed while restricting the resist from entering the conductive through hole by supplying a high pressure air to a rear surface of the base to pass through the conductive through hole using an air supply mechanism.

Abstract translation: 在其上具有BGA型成分的多层基板的制造方法中，在多层基板上形成用于限制信号干涉的导电性通孔和抗蚀剂膜，发生由抗蚀剂残留物引起的故障 导电通孔减少。 在其上具有BGA型部件的多层基板的制造方法中，形成抗蚀剂膜的步骤包括将感光性抗蚀剂涂布在基材的前表面部分的整体上的涂布步骤。 在使用空气供给机构通过向基座的后表面供给高压空气以通过导电性通孔的同时，进行施加步骤，同时限制抗蚀剂进入导电通孔。