公开(公告)号：US11795325B2

公开(公告)日：2023-10-24

申请号：US16885710

申请日：2020-05-28

Applicant: DENSO CORPORATION

Inventor： Akira Takakura ,  Hiroyuki Okuhira ,  Katsuhiro Kanie

IPC: C08L75/06 ,  C09J7/10 ,  C08G18/62 ,  C08G18/73 ,  C08G18/76 ,  C09J175/04

CPC classification number: C08L75/06 ,  C08G18/6204 ,  C08G18/6229 ,  C08G18/73 ,  C08G18/76 ,  C09J7/10 ,  C09J175/04 ,  C08L2203/16

Abstract: A curable resin composition comprises a (meth)acrylic polyol, a hydrogenated polyolefin-based polyol, and a polyisocyanate. The (meth)acrylic polyol includes a polymer having a hydroxyl value of 5 mg KOH/g or more and 150 mg KOH/g or less, a glass transition temperature of −70° C. or more and −40° C. or less, and a number average molecular weight of 500 or more and 20000 or less, and which is liquid at 25° C. The hydrogenated polyolefin-based polyol has an iodine value of 15 or less. An electrical component (1) comprises a sealing member (2) including a cured product of the curable resin composition.