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公开(公告)号:US09219425B2
公开(公告)日:2015-12-22
申请号:US13845657
申请日:2013-03-18
申请人: DENSO CORPORATION
发明人: Tomohisa Sano , Takahisa Kaneko , Kenshiro Hida , Kenji Funahashi
CPC分类号: H02M7/003 , B60L3/003 , B60L2240/36 , H02M2001/322
摘要: An electric power converter includes a semiconductor module that has a semiconductor element therein, a cooler that cools the semiconductor module, a circuit board provided with a semiconductor control circuit that controls the semiconductor module, a capacitor electrically connected to the semiconductor module, and a quick discharge resistor for discharging an electric charge accumulated in the capacitor. The circuit board is provided with a discharge control circuit that controls a current that flows into the quick discharge resistor. The semiconductor module, the cooler, the capacitor, and the quick discharge resistor are disposed on one major surface of the circuit board.
摘要翻译: 电力转换器包括:半导体元件,其中冷却半导体模块的冷却器;设置有控制半导体模块的半导体控制电路的电路板;与半导体模块电连接的电容器;以及快速 放电电阻器,用于放电蓄积在电容器中的电荷。 电路板上设有一个控制流入快速放电电阻器的电流的放电控制电路。 半导体模块,冷却器,电容器和快速放电电阻器设置在电路板的一个主表面上。
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公开(公告)号:US12068697B2
公开(公告)日:2024-08-20
申请号:US17669563
申请日:2022-02-11
申请人: DENSO CORPORATION
发明人: Yuuya Kiuchi , Kenshiro Hida
CPC分类号: H02M7/003 , H02M3/003 , H05K5/0217 , H02M3/158 , H02M7/53871 , H02P27/08
摘要: An electric conductive part for a power conversion circuit includes a connection conductive portion and a branch portion. The connection conductive portion is configured to connect a joint portion of a battery with a capacitor that is included in the power conversion circuit. The connection conductive portion includes a path portion, which is configured to connect the joint portion with the capacitor, and a branch portion that branches from the path portion. The branch portion extends toward a control circuit board and is connected with the control circuit board. The control circuit board is configured to control drive of a switch element of the power conversion circuit.
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公开(公告)号:US11302485B2
公开(公告)日:2022-04-12
申请号:US16802690
申请日:2020-02-27
申请人: DENSO CORPORATION
发明人: Yuya Kiuchi , Kenshiro Hida
摘要: A capacitor unit includes a capacitor having a positive electrode and a negative electrode, a positive bus bar, a negative bus bar, a sealing resin, an insulator. The positive bus bar and the negative bus bar are respectively connected to the positive electrode and the negative electrode. The sealing resin seals the capacitor, a part of the positive bus bar, and a part of the negative bus bar. The insulator is located between the positive bus bar and the negative bus bar. The insulator includes a recess recessed from either surface of the insulator facing the positive bus bar or the negative bus bar. At least a part of the recess is exposed from the sealing resin.
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公开(公告)号:US11252845B2
公开(公告)日:2022-02-15
申请号:US16851234
申请日:2020-04-17
申请人: DENSO CORPORATION
发明人: Tomoya Miura , Kenshiro Hida , Hiroyoshi Sawada
摘要: A power conversion device includes an electronic component, a cooler, a housing, protruding pipes, and annular seal members. Each of the seal members includes a seal body portion interposed between a corresponding one of the protruding pipes and the housing, and a flange portion extending outward from the seal body portion in a radial direction and contacting an outer surface of the housing from an axial direction. The housing includes a peripheral wall surface formed to surround the flange portion from an outer peripheral side, and an annular groove portion formed along an outer peripheral edge of the flange portion inside the peripheral wall surface. The peripheral wall surface is formed to extend outward, in the axial direction, from an axial contact surface of the housing contacted by the flange portion.
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公开(公告)号:US11590909B2
公开(公告)日:2023-02-28
申请号:US16844821
申请日:2020-04-09
申请人: DENSO CORPORATION
发明人: Shintaro Kogure , Kenshiro Hida
IPC分类号: B60R16/02 , B60R16/023 , H05K5/02 , H05K5/03
摘要: A sealing structure includes: a case that stores an in-vehicle electronic component and has an opening; and a first cover member that covers the opening of the case. The case includes: an protrusion member that has a sealing surface protruded to surround the opening; and a rib that is protruded on an opposite side of the opening with the protrusion member interposed therebetween. The rib has a discharge surface that is connected to the sealing surface of the protrusion member. The first cover member has an extension member that extends along the rib. The discharge surface of the rib is located to be lower than the sealing surface of the protrusion member while the case is arranged with the opening facing upward, and the extension member of the first cover member extends to be lower than the discharge surface of the rib.
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公开(公告)号:US11376944B2
公开(公告)日:2022-07-05
申请号:US16799167
申请日:2020-02-24
申请人: DENSO CORPORATION
发明人: Satoko Kumata , Kenshiro Hida , Shintaro Kogure
IPC分类号: B60K11/02
摘要: A reactor cooling device includes a housing, a reactor arranged in the housing, and a rotating body which is rotationally located below the reactor in the housing. The rotating body and the reactor are located so as to at least partially overlap with each other in a previously selected one of turning radius directions of the rotating body. A part of the rotating body is immersed in the coolant stored in the housing. The reactor cooling device is configured to cause a part of the coolant splashed by the rotation of the rotating body to be in contact with the reactor to thereby cool the reactor.
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公开(公告)号:US10658788B2
公开(公告)日:2020-05-19
申请号:US16594170
申请日:2019-10-07
申请人: DENSO CORPORATION
发明人: Kenshiro Hida
IPC分类号: H01R33/00 , H01R13/52 , H01R13/6591 , H01R13/74
摘要: A cover includes a cover body and an interlock connector. The cover body covers an opening provided in a case of a power conversion device and is electrically conductive. The interlock connector is electrically connectable to a receptacle connector provided inside the case. A noise shielding layer and a low conductivity layer are formed between the cover body and the interlock connector. The noise shielding layer is electrically conductive. The low conductivity layer is closer to the cover body than the noise shielding layer is, and is less electrically conductive than the cover body and the noise shielding layer.
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