公开(公告)号：US20150158221A1

公开(公告)日：2015-06-11

申请号：US14414831

申请日：2013-07-10

Applicant: DENSO CORPORATION

Inventor： Ryosuke Izumi ,  Takashige Saito ,  Hiroyuki Okuhira ,  Yuuichi Ikuno ,  Kouji Yamamoto

IPC: B29C45/16 ,  H05K5/00 ,  H05K5/06

CPC classification number: B29C45/16 ,  B29C43/18 ,  B29C45/02 ,  B29C45/14639 ,  B29C45/1657 ,  B29C45/1671 ,  B29C2045/1664 ,  B29K2101/10 ,  B29K2101/12 ,  B29L2031/3481 ,  G01L19/141 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/3142 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H05K5/0095 ,  H05K5/065 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electronic device includes a first molded product integrated with an electronic component, and a second molded product secondarily molded outside of the first molded product. The first molded product includes a thermosetting resin, and a first additive contained in the thermosetting resin, and the second molded product includes a thermoplastic resin, and a second additive contained in the thermoplastic resin and having a reactive group that chemically bonds with the first additive. At an interface between the first molded product and the second molded product, the first additive and the second additive are joined to each other by one or more joint actions selected from covalent bonding, ionic bonding, hydrogen bonding, intermolecular forces, dispersion force, and diffusion. As a result, the adhesion between both the molded products can be firmly secured through the molding technique such as the transfer molding method or the compression molding method.

Abstract translation: 电子设备包括与电子部件一体化的第一模制产品和在第一模制产品外部二次模制的第二模制产品。 第一模制产品包括热固性树脂和包含在热固性树脂中的第一添加剂，第二模塑产品包括热塑性树脂和包含在热塑性树脂中并具有与第一添加剂化学键合的反应性基团的第二添加剂 。 在第一模制产品和第二模制产品之间的界面处，第一添加剂和第二添加剂通过选自共价键，离子键，氢键，分子间力，分散力和 扩散。 结果，通过诸如传递模塑法或压缩模塑法的成型技术，可以牢固地确保两个成型产品之间的粘合性。

公开(公告)号：US09789637B2

公开(公告)日：2017-10-17

申请号：US14414831

申请日：2013-07-10

Applicant: DENSO CORPORATION

Inventor： Ryosuke Izumi ,  Takashige Saito ,  Hiroyuki Okuhira ,  Yuuichi Ikuno ,  Kouji Yamamoto

IPC: B29C45/16 ,  H05K5/00 ,  H05K5/06 ,  B29C43/18 ,  G01L19/14 ,  H01L21/56 ,  H01L23/31 ,  B29C45/14 ,  B29C45/02 ,  B29K101/10 ,  B29K101/12 ,  B29L31/34

CPC classification number: B29C45/16 ,  B29C43/18 ,  B29C45/02 ,  B29C45/14639 ,  B29C45/1657 ,  B29C45/1671 ,  B29C2045/1664 ,  B29K2101/10 ,  B29K2101/12 ,  B29L2031/3481 ,  G01L19/141 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/3142 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H05K5/0095 ,  H05K5/065 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electronic device includes a first molded product integrated with an electronic component, and a second molded product secondarily molded outside of the first molded product. The first molded product includes a thermosetting resin, and a first additive contained in the thermosetting resin, and the second molded product includes a thermoplastic resin, and a second additive contained in the thermoplastic resin and having a reactive group that chemically bonds with the first additive. At an interface between the first molded product and the second molded product, the first additive and the second additive are joined to each other by one or more joint actions selected from covalent bonding, ionic bonding, hydrogen bonding, intermolecular forces, dispersion force, and diffusion. As a result, the adhesion between both the molded products can be firmly secured through the molding technique such as the transfer molding method or the compression molding method.