公开(公告)号：US20140084437A1

公开(公告)日：2014-03-27

申请号：US14091507

申请日：2013-11-27

Applicant: DENSO CORPORATION

Inventor： Masao YAMADA ,  Tetsuo FUJII

IPC: H01L23/495

CPC classification number: H01L23/49575 ,  H01L23/49589 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A semiconductor device includes a lead frame, a semiconductor chip, a substrate, a plurality of chip parts, a plurality of wires, and a resin member. The lead frame includes a chip mounted section and a plurality of lead sections. The semiconductor chip is mounted on the chip mounted section. The substrate is mounted on the chip mounted section. The chip parts are mounted on the substrate. Each of the chip parts has a first end portion and a second end portion in one direction, and each of the chip parts has a first electrode at the first end portion and a second electrode at the second end portion. Each of the wires couples the second electrode of one of the chip parts and one of the lead sections. The resin member covers the lead frame, the semiconductor chip, the substrate, the chip parts, and the wires.

Abstract translation: 半导体器件包括引线框架，半导体芯片，基板，多个芯片部件，多个导线以及树脂部件。 引线框架包括芯片安装部分和多个引线部分。 半导体芯片安装在芯片安装部分上。 基板安装在芯片安装部分上。 芯片部件安装在基板上。 每个芯片部件在一个方向上具有第一端部部分和第二端部部分，并且每个芯片部分在第一端部具有第一电极，在第二端部具有第二电极。 每个电线将芯片部件之一的第二电极和引线部分中的一个耦合。 树脂构件覆盖引线框架，半导体芯片，基板，芯片部件和电线。

公开(公告)号：US20150362392A1

公开(公告)日：2015-12-17

申请号：US14764197

申请日：2014-02-21

Applicant: DENSO CORPORATION

Inventor： Katsunori TANIDA ,  Takeshi MURATA ,  Naoki FUJIMOTO ,  Masao YAMADA

IPC: G01L9/00

CPC classification number: G01L9/0051 ,  G01L23/28 ,  Y10T29/49131

Abstract: A method for manufacturing a pressure sensor includes: preparing a stem which has a cylindrical shape with a bottom as a diaphragm; mounting a sensor chip on the diaphragm; preparing a conductive member, in which an internal connection region is integrated with an external connection region electrically connected to an external circuit by an outer frame; forming a first resin mold to couple the internal connection region to the external connection region; separating the outer frame from the internal connection region and the external connection region; arranging the internal connection region in the stem; and electrically connecting the sensor chip and the internal connection region through the first connection member.

Abstract translation: 制造压力传感器的方法包括：准备具有圆柱形状的杆，底部作为隔膜; 将传感器芯片安装在隔膜上; 制备导电构件，其中内部连接区域与通过外框电连接到外部电路的外部连接区域一体化; 形成第一树脂模具以将所述内部连接区域连接到所述外部连接区域; 将外框架与内部连接区域和外部连接区域分离; 将杆内的内部连接区域排列; 以及通过所述第一连接构件将所述传感器芯片和所述内部连接区域电连接。