Reflow soldering system
    1.
    发明授权
    Reflow soldering system 有权
    回流焊系统

    公开(公告)号:US08807416B2

    公开(公告)日:2014-08-19

    申请号:US13668988

    申请日:2012-11-05

    Abstract: A reflow soldering system wherein a heating oven is provided with a contact heating unit which has a transport rail and a top heat transfer heater, and with a hot gas blowing heating unit, the transport rail and top heat transfer heater are respectively provided with heaters which heat the outer edge part of the printed circuit board, and the transport rail or top heat transfer heater moves in an up-down direction so that the transport rail and top heat transfer heater clamp and heat the outer edge part of the printed circuit board.

    Abstract translation: 一种回流焊接系统,其中加热炉设置有具有输送轨道和顶部传热加热器的接触加热单元,并且具有热气体吹送加热单元,输送轨道和顶部传热加热器分别设有加热器, 加热印刷电路板的外边缘部分,并且输送轨道或顶部传热加热器沿上下方向移动,使得输送轨道和顶部传热加热器夹紧并加热印刷电路板的外边缘部分。

    Material heating and providing apparatus
    2.
    发明授权
    Material heating and providing apparatus 有权
    材料加热和提供装置

    公开(公告)号:US09351346B2

    公开(公告)日:2016-05-24

    申请号:US13720158

    申请日:2012-12-19

    CPC classification number: H05B6/46 H05B6/6408

    Abstract: A dielectric heating system which is provided with a high frequency oscillator, a housing which forms part of a waveguide and is provided with a loading opening and unloading opening, first and second conductive closing members which respectively close the loading opening and the unloading opening from the inner side of the housing, and a first position holding member which holds the object to be heated inside the housing, which makes the first conductive closing member slide to open the loading opening and charges the object to be heated into the housing, and which makes the second conductive closing member slide to open the unloading opening and unload the object to outside the housing.

    Abstract translation: 一种电介质加热系统,其具有高频振荡器,构成波导的一部分并具有加载开口和卸载开口的壳体,第一和第二导电闭合部件,其分别从所述第一和第二导电闭合部件接收所述加载开口和所述卸载开口 壳体的内侧,以及将壳体内的待加热物体保持的第一位置保持构件,其使第一导电闭合件滑动以打开装载开口并将待加热物体充入壳体,并且使得 第二导电闭合件滑动以打开卸载开口并将物体卸载到壳体外部。

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