公开(公告)号：US11742135B2

公开(公告)日：2023-08-29

申请号：US16895826

申请日：2020-06-08

Applicant: DENSO CORPORATION

Inventor： Shotaro Yamasaki

IPC: H01F27/30 ,  H01F27/32 ,  H01F41/12 ,  H01F27/28 ,  H02M3/158 ,  H01F27/08 ,  H01F30/06

CPC classification number: H01F27/32 ,  H01F27/08 ,  H01F27/2876 ,  H01F30/06 ,  H01F41/12 ,  H02M3/158

Abstract: A novel transformer includes a first coil, at least one secondary coil magnetically coupled with the first coil and an electrically insulating holder. The first coil and the at least one secondary coil face each other with the holder therebetween. The holder has at least one through hole at a portion sandwiched between the first coil and the at least one second coil. The transformer also includes at least one electric insulating heat radiation member disposed in the at least one through hole in contact with the first coil and the at least one second coil. The heat radiation member has a higher heat conductivity than the holder.

公开(公告)号：US11425846B2

公开(公告)日：2022-08-23

申请号：US16744904

申请日：2020-01-16

Applicant: DENSO CORPORATION

Inventor： Kwan Ryul Kim ,  Shotaro Yamasaki

IPC: H05K7/20 ,  H02M3/335 ,  H01F27/28 ,  H01L25/16 ,  H01L27/02 ,  H01L23/367 ,  H01F27/02

Abstract: A DC-DC converter as an electric power source device has a magnetic component, a semiconductor component, a circuit substrate and a thermal conductive component. The magnetic component has a thermal energy discharge surface. The semiconductor component is electrically connected to the magnetic component. A controller arranged on the circuit substrate is electrically connected to the semiconductor component to control behavior of the semiconductor component. The thermal conductive component is arranged in a thickness direction of the circuit substrate to be overlapped with the magnetic component. The thermal conductive component is arranged, without being electrically connected with the semiconductor component and the circuit substrate, to face the thermal energy discharge surface of the magnetic component to allow thermal energy generated in the magnetic component to be conducted with the thermal conductive component.

公开(公告)号：US09293994B2

公开(公告)日：2016-03-22

申请号：US14338783

申请日：2014-07-23

Applicant: DENSO CORPORATION

Inventor： Shuji Kurauchi ,  Katsutoyo Misawa ,  Yuuki Takemoto ,  Yuuichi Handa ,  Shotaro Yamasaki

IPC: H02M3/335 ,  H05K7/02 ,  H05K7/14 ,  H02M3/00

CPC classification number: H02M3/335 ,  H01F27/06 ,  H02M3/00 ,  H05K7/1432

Abstract: An electric power source device has a transformer, primary side semiconductor components, secondary side semiconductor components, a choke coil, a base plate and first circuit substrate and one or more second circuit substrates. The transformer has a primary side coil and a secondary side coil. The primary side semiconductor components form a primary side circuit connected to the primary side coil. The secondary side semiconductor components form a secondary side circuit connected to the secondary side coil. The choke coil has a smoothing circuit for smoothing an output voltage. The transformer, the primary side semiconductor components, the secondary side semiconductor components and the choke coil are formed on the base plate. The first circuit substrate is arranged parallel to the base plate. The second circuit substrate is arranged parallel to a normal line of the first circuit substrate.

Abstract translation: 电源装置具有变压器，初级侧半导体部件，二次侧半导体部件，扼流线圈，基板和第一电路基板以及一个以上的第二电路基板。 变压器具有初级侧线圈和次级侧线圈。 初级侧半导体元件形成连接到初级侧线圈的初级侧电路。 次级侧半导体部件形成与次级侧线圈连接的次级侧电路。 扼流线圈具有用于平滑输出电压的平滑电路。 变压器，初级侧半导体部件，次级侧半导体部件和扼流线圈形成在基板上。 第一电路基板平行于基板设置。 第二电路基板平行于第一电路基板的法线布置。

公开(公告)号：US09923473B2

公开(公告)日：2018-03-20

申请号：US15302822

申请日：2015-04-06

Applicant: DENSO CORPORATION

Inventor： Shuji Kurauchi ,  Katsutoyo Misawa ,  Shotaro Yamasaki ,  Yuuichi Handa ,  Yuuki Takemoto

IPC: H02M3/335 ,  H02M7/00 ,  H01F27/40 ,  H02M3/337 ,  H01L25/16

CPC classification number: H02M3/33569 ,  H01F27/40 ,  H01L25/16 ,  H02M3/337 ,  H02M7/003

Abstract: In a power supply apparatus, one of a transformer and a first semiconductor device is stacked on the other thereof to constitute a stack assembly. The stack assembly, a second semiconductor device, and a choke coil are located on the major surface. A primary direct-current wire, which connects the first semiconductor device to a direct-current power source, is drawn out from a first predetermined portion of the stack assembly. A primary alternating-current wire, which connects the first semiconductor device and the transformer, is drawn out from a second predetermined portion of the stack assembly. The primary direct-current wire and the primary alternating-current wire are located to be separated from each other via at least a part of the stack assembly.

公开(公告)号：US09647535B2

公开(公告)日：2017-05-09

申请号：US14447118

申请日：2014-07-30

Applicant: DENSO CORPORATION

Inventor： Yuuichi Handa ,  Katsutoyo Misawa ,  Yuuki Takemoto ,  Shotaro Yamasaki ,  Shuji Kurauchi

IPC: H02M1/44 ,  H02M3/24 ,  H02M3/28 ,  H01F27/06

CPC classification number: H02M1/44 ,  H01F27/06 ,  H02M3/24 ,  H02M3/28

Abstract: A power-supply apparatus is provided which includes a transformer, a primary semiconductor unit, a secondary semiconductor unit, and a secondary electronic device. Each of the primary semiconductor unit and the secondary semiconductor units has a plurality of semiconductor devices installed therein. The transformer, the primary semiconductor unit, the secondary semiconductor unit, and the secondary electronic device are electrically joined through connecting conductors. The transformer is laid on the primary semiconductor unit to make a first stack. Similarly, the secondary electronic device is laid on the secondary semiconductor unit. This permits the power-supply apparatus to be reduced in overall size thereof and minimizes adverse effects of electromagnetic noise to ensure the high efficiency in power supply operation.