公开(公告)号：US11747183B2

公开(公告)日：2023-09-05

申请号：US17374202

申请日：2021-07-13

Applicant: DENSO CORPORATION

Inventor： Takuma Tsuchiya ,  Akiyuki Sudou

IPC: G01F1/684 ,  G01F5/00 ,  B29C33/00 ,  B29C45/00 ,  B29C65/00

CPC classification number: G01F1/6842 ,  B29C33/005 ,  G01F5/00 ,  B29C45/0025 ,  B29C66/306 ,  B29C66/328 ,  B29C2045/0034

Abstract: A housing has a front surface, a rear surface, and side surface connecting the front surface with the rear surface. The housing is formed by injection molding. A first sub-passage is formed in the housing and communicates a first sub-passage inlet formed in the front surface with a first sub-passage outlet formed in the rear surface. A second sub-passage is formed in the housing and communicates a second sub-passage inlet formed in a midway portion of the first sub-passage with a second sub-passage outlet at a position different from the first sub-passage outlet. A flow rate detection unit is provided in the second sub-passage. A mold parting mark is formed in the rear surface of the housing at a position away from an inner opening edge of the first sub-passage outlet.

公开(公告)号：US11221246B2

公开(公告)日：2022-01-11

申请号：US17005364

申请日：2020-08-28

Applicant: DENSO CORPORATION

Inventor： Takuma Tsuchiya ,  Kengo Itou ,  Noboru Kitahara ,  Yasushi Goka

IPC: G01F1/688 ,  G01F1/696 ,  F02M35/10

Abstract: A physical quantity sensing device is installed to a circuit board and is configured to output a signal, which corresponds to a physical quantity of air flowing through a physical quantity measurement passage. A physical quantity measurement passage inlet, which is communicated with the physical quantity measurement passage, includes a first inner surface and a second inner surface. A second distance, which is measured from the physical quantity sensing device to the second inner surface in a plate thickness direction of the circuit board, is larger than a first distance, which is measured from the circuit board to the first inner surface in the plate thickness direction of the circuit board.

公开(公告)号：US10962391B2

公开(公告)日：2021-03-30

申请号：US16267421

申请日：2019-02-05

Applicant: DENSO CORPORATION

Inventor： Takuma Tsuchiya ,  Junzo Yamaguchi ,  Takashi Enomoto ,  Hiroyuki Akuzawa

IPC: G01D11/24 ,  G01F1/684 ,  G01M15/02 ,  G01N27/22 ,  F02D41/18

Abstract: A sensor body contains a sensor element in a body recess opened at a body opening. A sensor substrate has a mounting surface on which a circuit element for processing a detection signal is mounted and holds the sensor body on the mounting surface. A sensor cover has a cover window penetrating between an intake passage and the body opening and covers the sensor body. A sensor filter is interposed between the sensor body and the sensor cover. A potting resin body is cured on the mounting surface so as to seal the circuit element. The sensor cover is embedded in the potting resin body on the outer peripheral side of the sensor body.