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公开(公告)号：US20220369463A1
公开(公告)日：2022-11-17
申请号：US17878319
申请日：2022-08-01
Applicant: DENSO CORPORATION
Inventor： Keitaro ITO , Teruhisa AKASHI , Hideki TERASAWA , Suguru HOUCHI , Naoki YOSHIDA
IPC: H05K1/18
Abstract: An electronic device includes a mounting member having a surface, an electronic component, a solder and a sidefill. The electronic component has a plurality of electrodes on a surface and is mounted on the surface of the mounting member so that the surface of the electronic component having the electrodes faces the surface of the mounting member. The solder is disposed between the mounting member and at least one of the electrodes of the electronic component to electrically and mechanically connect between the at least one of the electrodes and the mounting member. The sidefill is disposed on a periphery of the solder and mechanically connects between the electronic component and the mounting member.
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公开(公告)号：US20220316880A1
公开(公告)日：2022-10-06
申请号：US17703164
申请日：2022-03-24
Inventor： Shota HARADA , Keitaro ITO , Katsuaki GOTO , Yuuki INAGAKI , Takahiko YOSHIDA , Yusuke KAWAI , Teruhisa AKASHI , Hirofumi FUNABASHI
Abstract: A micro vibration body includes a curved surface portion, a recessed portion recessed from the curved surface portion, a bottom surface protruding portion protruding from a bottom surface of the recessed portion, and a through hole in the bottom surface protruding portion. A mounting substrate has a positioning recess, into which the bottom surface protruding portion is inserted, and electrode portions surrounding the inner frame portion. A joining member is in the positioning recess and joins the bottom surface protruding portion with the mounting substrate. The bottom surface is in contact with a region of the mounting substrate around the positioning recess. The bottom surface protruding portion has a tip end surface that is at a distance from the positioning recess. The joining member at least partially enters the through hole and is electrically connected to the conductive layer.
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公开(公告)号：US20220353996A1
公开(公告)日：2022-11-03
申请号：US17867255
申请日：2022-07-18
Applicant: DENSO CORPORATION
Inventor： Keitaro ITO , Teruhisa AKASHI , Hirofumi FUNABASHI
IPC: H05K1/18
Abstract: An electronic device includes a component mounting portion, an electronic component disposed on the component mounting portion, a solder between the component mounting portion and the electronic component, a mounting base member, and a supporting beam connecting the component mounting portion and the mounting base member. The supporting beam has a plurality of bent portions. The supporting beam includes a frame, an outer supporting portion connecting the frame and the mounting base member, and an inner supporting portion connecting the frame and the component mounting portion. The inner supporting portion is shifted from the outer supporting portion along the frame. One of the plurality of bent portions is a connecting portion between the frame and the outer supporting portion. Another of the plurality of bent portions is a connecting portion between the frame and the inner supporting portion.
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公开(公告)号：US20230243656A1
公开(公告)日：2023-08-03
申请号：US18297984
申请日：2023-04-10
Applicant: DENSO CORPORATION
Inventor： Teruhisa AKASHI , Shota HARADA
IPC: G01C21/18 , G01C19/06 , G01C19/18 , G01C19/5776 , G01C19/5783
CPC classification number: G01C21/18 , G01C19/065 , G01C19/18 , G01C19/5776 , G01C19/5783
Abstract: Before a pedestal is assembled, a sensitivity is inspected for each of sensors disposed in blocks respectively. In an inspection step, the blocks in which the sensors are disposed respectively are prepared. The blocks are fitted into main-axis groove portions of a main-axis tray, and the blocks are brought in contact with main-axis positioning surfaces of the main-axis groove portions to dispose the thickness direction of the main-axis tray and the main-axes of the sensors in parallel. The main-axis tray is arranged on a turntable such that a central axis of rotation of the turntable and the thickness direction of the main-axis tray are in parallel and that the central axis of rotation of the turntable and the main-axes of the sensors are in parallel. The turntable is made pivoting or swinging to inspect the sensitivities, in the main-axes, of the of sensors.
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Patent Agency Ranking
公开(公告)号：US20210035799A1
公开(公告)日：2021-02-04
申请号：US17030874
申请日：2020-09-24
Applicant: DENSO CORPORATION , KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
Inventor： Megumi SUZUKI , Yasuo YAMAMOTO , Teruhisa AKASHI
Abstract: A recess is formed in one silicon substrate. A silicon oxide film is formed in another one silicon substrate at a portion space apart from a space-to-be-formed region. The silicon oxide film has a groove surrounding the space-to-be-formed region and extending to an outer periphery of the other one silicon substrate. Further, the other one silicon substrate and the one silicon substrate are directly bonded to each other via the silicon oxide film so as to cover the groove. A gas discharge passage, a stacking structure of the silicon substrates and the silicon oxide film are formed, and the space is formed inside the stacking structure by the recess. Then, by the heat treatment, the gas inside the space is discharged to the outside of the stacking structure through the gas discharge passage.
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公开(公告)号：US20230243866A1
公开(公告)日：2023-08-03
申请号：US18297929
申请日：2023-04-10
Applicant: DENSO CORPORATION
Inventor： Teruhisa AKASHI , Shota HARADA , Yoshiyuki HATA
Abstract: A multi-axis inertial force sensor includes a mounting material, blocks, and sensors. Each block has a positioning portion that determines its position relative to a contact partner. A pedestal is formed by an assembly of the blocks where the positions are determined relative to each other based on the positioning portion and where inclined surfaces are oriented in different directions. The sensors are respectively arranged on the inclined surfaces of the pedestal so that the main axes are oriented in different directions to detect vector components of inertial force corresponding to the main axes.
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公开(公告)号：US20220315411A1
公开(公告)日：2022-10-06
申请号：US17703418
申请日：2022-03-24
Inventor： Keitaro ITO , Shota HARADA , Katsuaki GOTO , Yuuki INAGAKI , Teruhisa AKASHI , Hirofumi FUNABASHI , Takahiko YOSHIDA , Yusuke KAWAI
Abstract: A micro vibration body includes a curved surface portion, which has an annular curved surface, and a recessed portion, which is recessed from the curved surface portion. A mounting substrate includes an inner frame portion and electrode portions, which surround an inner frame portion. A joining member is provided in an inner region of the mounting substrate surrounded by the inner frame portion. The recessed portion of the micro vibration body has a bottom surface defining a mounted surface located in the inner region and joined to the mounting substrate via the joining member. The curved surface portion has a rim that includes an end portion of the curved surface portion on an opposite side to the recessed portion. The rim has a rim lower surface located on a same plane as the mounted surface or a tip end portion of the mounted surface.
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公开(公告)号：US20210041475A1
公开(公告)日：2021-02-11
申请号：US17082199
申请日：2020-10-28
Applicant: DENSO CORPORATION
Inventor： Shota HARADA , Keitaro ITO , Tomoya JOMORI , Hideo YAMADA , Yuuki INAGAKI , Teruhisa AKASHI , Yoshiyuki HATA
Abstract: An electrostatic actuator includes a fixed electrode and a movable electrode arranged to face the fixed electrode. The movable electrode is configured to be displaceable with respect to the fixed electrode and a fixed portion. An attractive force acts between the movable electrode and the fixed portion. In the electrostatic actuator, a non-linear vibration of the movable electrode when a voltage is applied to the fixed electrode and the movable electrode is reduced by the attractive force acting between the movable electrode and the fixed portion.
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公开(公告)号：US20200299128A1
公开(公告)日：2020-09-24
申请号：US16805112
申请日：2020-02-28
Applicant: DENSO CORPORATION
Inventor： Megumi SUZUKI , Teruhisa AKASHI
Abstract: In a semiconductor device, a first substrate and a second substrate are bonded to each other through an insulating film. A hermetically sealed chamber is provided between the first substrate and the second substrate, and a sensing part is enclosed in the hermetically sealed chamber. The second substrate has a through hole penetrating in a stacking direction of the first substrate and the second substrate and exposing the first surface of the first substrate. A penetrating electrode is disposed on a wall surface of the through hole of the second substrate, and is electrically connected to the sensing part. A discharge path is provided, at a position located between the hermetically sealed chamber and the through hole for releasing outgas generated during bonding from the hermetically sealed chamber to the through hole.
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