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公开(公告)号：US20220353996A1
公开(公告)日：2022-11-03
申请号：US17867255
申请日：2022-07-18
Applicant: DENSO CORPORATION
Inventor： Keitaro ITO , Teruhisa AKASHI , Hirofumi FUNABASHI
IPC: H05K1/18
Abstract: An electronic device includes a component mounting portion, an electronic component disposed on the component mounting portion, a solder between the component mounting portion and the electronic component, a mounting base member, and a supporting beam connecting the component mounting portion and the mounting base member. The supporting beam has a plurality of bent portions. The supporting beam includes a frame, an outer supporting portion connecting the frame and the mounting base member, and an inner supporting portion connecting the frame and the component mounting portion. The inner supporting portion is shifted from the outer supporting portion along the frame. One of the plurality of bent portions is a connecting portion between the frame and the outer supporting portion. Another of the plurality of bent portions is a connecting portion between the frame and the inner supporting portion.
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公开(公告)号：US20230061042A1
公开(公告)日：2023-03-02
申请号：US17884111
申请日：2022-08-09
Inventor： Katsuaki GOTO , Shota HARADA , Keitaro ITO , Yuuki INAGAKI , Takahiko YOSHIDA , Yusuke KAWAI
Abstract: In a method for manufacturing a micro vibration body having a three-dimensional curved surface, a mold defining a recess part is prepared, and a plate-shaped reflow material is arranged on the mold so as to cover the recess part. Pressure of a space defined by the recess part covered with the reflow material is reduced, and the reflow material is deformed by heating from an upper surface side opposite to a lower surface facing the recess part and by means of the pressure reduced. When the reflow material is deformed, a part of the mold is heated and / or cooled. As another example, when the reflow material is deformed, a mold having a different heat capacity portion is used to generate a temperature gradient in the mold.
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公开(公告)号：US20220316880A1
公开(公告)日：2022-10-06
申请号：US17703164
申请日：2022-03-24
Inventor： Shota HARADA , Keitaro ITO , Katsuaki GOTO , Yuuki INAGAKI , Takahiko YOSHIDA , Yusuke KAWAI , Teruhisa AKASHI , Hirofumi FUNABASHI
Abstract: A micro vibration body includes a curved surface portion, a recessed portion recessed from the curved surface portion, a bottom surface protruding portion protruding from a bottom surface of the recessed portion, and a through hole in the bottom surface protruding portion. A mounting substrate has a positioning recess, into which the bottom surface protruding portion is inserted, and electrode portions surrounding the inner frame portion. A joining member is in the positioning recess and joins the bottom surface protruding portion with the mounting substrate. The bottom surface is in contact with a region of the mounting substrate around the positioning recess. The bottom surface protruding portion has a tip end surface that is at a distance from the positioning recess. The joining member at least partially enters the through hole and is electrically connected to the conductive layer.
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Patent Agency Ranking
公开(公告)号：US20220315411A1
公开(公告)日：2022-10-06
申请号：US17703418
申请日：2022-03-24
Inventor： Keitaro ITO , Shota HARADA , Katsuaki GOTO , Yuuki INAGAKI , Teruhisa AKASHI , Hirofumi FUNABASHI , Takahiko YOSHIDA , Yusuke KAWAI
Abstract: A micro vibration body includes a curved surface portion, which has an annular curved surface, and a recessed portion, which is recessed from the curved surface portion. A mounting substrate includes an inner frame portion and electrode portions, which surround an inner frame portion. A joining member is provided in an inner region of the mounting substrate surrounded by the inner frame portion. The recessed portion of the micro vibration body has a bottom surface defining a mounted surface located in the inner region and joined to the mounting substrate via the joining member. The curved surface portion has a rim that includes an end portion of the curved surface portion on an opposite side to the recessed portion. The rim has a rim lower surface located on a same plane as the mounted surface or a tip end portion of the mounted surface.
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公开(公告)号：US20210041475A1
公开(公告)日：2021-02-11
申请号：US17082199
申请日：2020-10-28
Applicant: DENSO CORPORATION
Inventor： Shota HARADA , Keitaro ITO , Tomoya JOMORI , Hideo YAMADA , Yuuki INAGAKI , Teruhisa AKASHI , Yoshiyuki HATA
Abstract: An electrostatic actuator includes a fixed electrode and a movable electrode arranged to face the fixed electrode. The movable electrode is configured to be displaceable with respect to the fixed electrode and a fixed portion. An attractive force acts between the movable electrode and the fixed portion. In the electrostatic actuator, a non-linear vibration of the movable electrode when a voltage is applied to the fixed electrode and the movable electrode is reduced by the attractive force acting between the movable electrode and the fixed portion.
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公开(公告)号：US20240401948A1
公开(公告)日：2024-12-05
申请号：US18659102
申请日：2024-05-09
Inventor： Keitaro ITO , Shota HARADA , Katsuaki GOTO , Yuuki INAGAKI , Hideaki NISHIKAWA , Takahiko YOSHIDA , Yusuke KAWAI
IPC: G01C19/5712
Abstract: An inertial sensor includes a resonator, a mounting board, and an actuator. The resonator has a first drive mode and a second drive mode. The mounting board has a plurality of electrode portions arranged at a distance from each other and surrounding the resonator. The actuator is configured to vibrate in a z-axis direction. The z-axis direction is a direction orthogonal to a planar direction of the mounting board. The actuator is further configured to vibrate the resonator in the z-axis direction to cause a resonance mode.
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公开(公告)号：US20230324175A1
公开(公告)日：2023-10-12
申请号：US18189322
申请日：2023-03-24
Inventor： Hideaki NISHIKAWA , Yusuke KAWAI , Takahiko YOSHIDA , Yuuki INAGAKI , Shota HARADA , Keitaro ITO , Katsuaki GOTO
IPC: G01C19/5691 , B81B3/00
CPC classification number: G01C19/5691 , B81B3/0086 , B81B2201/0242 , B81B2203/04
Abstract: A mounting structure includes a micro vibrator and a mounting substrate. The micro vibrator includes a curved surface portion having an annular curved surface and a connecting portion extending from the curved surface portion toward an inner center position of the curved surface portion. The micro vibrator is disposed so that the connecting portion is bonded to the mounting substrate and the curved surface portion is in a hollow state free from other elements. The mounting substrate includes a plurality of electrode portions that are arranged to face and surround a rim of the curved surface portion of the micro vibrator, and spaced apart from each other, the rim being an end of the curved surface portion opposite to the connecting portion. Further, the mounting substrate includes a guard electrode.
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公开(公告)号：US20220369463A1
公开(公告)日：2022-11-17
申请号：US17878319
申请日：2022-08-01
Applicant: DENSO CORPORATION
Inventor： Keitaro ITO , Teruhisa AKASHI , Hideki TERASAWA , Suguru HOUCHI , Naoki YOSHIDA
IPC: H05K1/18
Abstract: An electronic device includes a mounting member having a surface, an electronic component, a solder and a sidefill. The electronic component has a plurality of electrodes on a surface and is mounted on the surface of the mounting member so that the surface of the electronic component having the electrodes faces the surface of the mounting member. The solder is disposed between the mounting member and at least one of the electrodes of the electronic component to electrically and mechanically connect between the at least one of the electrodes and the mounting member. The sidefill is disposed on a periphery of the solder and mechanically connects between the electronic component and the mounting member.
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