公开(公告)号：US09473004B2

公开(公告)日：2016-10-18

申请号：US14812769

申请日：2015-07-29

Applicant: DENSO CORPORATION

Inventor： Yuuta Kadoike ,  Hideki Kabune ,  Hiroyuki Kawata

IPC: H02K1/32 ,  H02K9/22 ,  B62D5/04 ,  H02K11/00

CPC classification number: H02K9/22 ,  B62D5/0406 ,  B62D5/0412 ,  H02K11/33

Abstract: A drive device that includes a motor having a rotor disposed relative to a stator, a cover having a one-end-closed cylinder shape and positioned on one axial end side of the motor, and a substrate on the inside of the cover perpendicular to a motor shaft having electronic components implemented on the substrate. The drive device also includes a connector positioned on a motor side of the substrate with an opening that is connectable to an external terminal. The opening of the connector faces outward relative to the motor shaft. The drive device further includes a heat sink having a frame end part and a heat receiving part formed in one body. The drive device increases heat capacity of the heat sink without increasing its height.

Abstract translation: 一种驱动装置，包括具有相对于定子设置的转子的电动机，具有一端闭合圆筒形并且位于所述电动机的一个轴向端侧的盖，以及垂直于所述电动机的所述盖的内侧的基板 电机轴具有在基板上实现的电子部件。 驱动装置还包括位于基板的马达侧的连接器，该连接器具有可连接到外部端子的开口。 连接器的开口相对于电机轴向外面。 驱动装置还包括具有框架端部和形成在一体内的受热部的散热器。 驱动装置增加散热器的热容量而不增加散热器的高度。

公开(公告)号：US10374490B2

公开(公告)日：2019-08-06

申请号：US14811601

申请日：2015-07-28

Applicant: DENSO CORPORATION

Inventor： Toshihisa Yamamoto ,  Hideki Kabune ,  Yuuta Kadoike

IPC: H02K9/22 ,  H02K11/00 ,  H05K7/20 ,  H02K11/33

Abstract: An electronic device includes a heat sink, where heat dissipating gel is interposed between the heat sink and a side of an electronic component, which is mounted on a substrate, opposite from the substrate. The electronic component includes an electrical conductor electrically connected to a chip, and an insulator portion that molds the chip with the electrical conductor. The heat sink includes a non-abutting surface that faces the electrical conductor of the electronic component, the heat dissipating gel interposed between the non-abutting surface and the electrical conductor, and an abutting surface that is positioned closer toward the substrate than the non-abutting surface is and abuttable with the insulator portion. Accordingly, when the abutting surface of the heat sink abuts the insulator portion of the electronic component, the non-abutting surface of the heat sink is prevented from abutting the electrical conductor of the electronic component.

公开(公告)号：US20160036298A1

公开(公告)日：2016-02-04

申请号：US14811601

申请日：2015-07-28

Applicant: DENSO CORPORATION

Inventor： Toshihisa Yamamoto ,  Hideki Kabune ,  Yuuta Kadoike

IPC: H02K9/22 ,  H02K11/00 ,  H05K7/20

CPC classification number: H02K9/22 ,  H02K11/33 ,  H05K7/20454 ,  H05K7/20463 ,  H05K7/205 ,  H05K7/209

Abstract: An electronic device includes a heat sink, where heat dissipating gel is interposed between the heat sink and a side of an electronic component, which is mounted on a substrate, opposite from the substrate. The electronic component includes an electrical conductor electrically connected to a chip, and an insulator portion that molds the chip with the electrical conductor. The heat sink includes a non-abutting surface that faces the electrical conductor of the electronic component, the heat dissipating gel interposed between the non-abutting surface and the electrical conductor, and an abutting surface that is positioned closer toward the substrate than the non-abutting surface is and abuttable with the insulator portion. Accordingly, when the abutting surface of the heat sink abuts the insulator portion of the electronic component, the non-abutting surface of the heat sink is prevented from abutting the electrical conductor of the electronic component.

Abstract translation: 电子设备包括散热器，其中散热凝胶介于散热器和安装在与基板相对的基板上的电子部件的一侧。 电子部件包括电连接到芯片的电导体和将芯片与电导体模制的绝缘体部分。 散热器包括面对电子部件的电导体的非接触表面，插入在非接触表面和电导体之间的散热凝胶以及比非接触表面更靠近基板的抵接表面， 邻接表面可与绝缘体部分邻接。 因此，当散热器的抵接面与电子部件的绝缘体部分抵接时，防止散热片的非抵接面与电子部件的导电体抵接。

公开(公告)号：US09791298B2

公开(公告)日：2017-10-17

申请号：US14990671

申请日：2016-01-07

Applicant: DENSO CORPORATION

Inventor： Yuuta Kadoike ,  Shuhei Miyachi ,  Takafumi Satou

IPC: G01B7/00 ,  G01B7/30 ,  G01D5/20 ,  G01B21/04

CPC classification number: G01D5/20 ,  G01B7/30 ,  G01B21/045

Abstract: A rotation angle detector has a rotation angle sensor and a microcomputer, where the sensor detects a change of a magnetic field of a magnet that rotates with a shaft. The microcomputer has a first corrector for correcting a pre-correction mechanical angle, based on a first correction value that corrects an error due to an assembly process for assembling the magnet and the sensor, and a second corrector for correcting the pre-correction mechanical angle based on a second correction value that corrects an error due to a spill magnetic flux that is generated by a supply of an electric current to a winding wire. In such configuration, the rotation angle detector may correct the error due to the spill magnetic flux, thereby enabling an accurate detection of a mechanical angle.

公开(公告)号：US20160202087A1

公开(公告)日：2016-07-14

申请号：US14990671

申请日：2016-01-07

Applicant: DENSO CORPORATION

Inventor： Yuuta Kadoike ,  Shuhei Miyachi ,  Takafumi Satou

IPC: G01D5/20 ,  G01B7/30

CPC classification number: G01D5/20 ,  G01B7/30 ,  G01B21/045

Abstract: A rotation angle detector has a rotation angle sensor and a microcomputer, where the sensor detects a change of a magnetic field of a magnet that rotates with a shaft. The microcomputer has a first corrector for correcting a pre-correction mechanical angle, based on a first correction value that corrects an error due to an assembly process for assembling the magnet and the sensor, and a second corrector for correcting the pre-correction mechanical angle based on a second correction value that corrects an error due to a spill magnetic flux that is generated by a supply of an electric current to a winding wire. In such configuration, the rotation angle detector may correct the error due to the spill magnetic flux, thereby enabling an accurate detection of a mechanical angle.

Abstract translation: 旋转角度检测器具有旋转角度传感器和微型计算机，其中传感器检测与轴一起旋转的磁体的磁场的变化。 微型计算机具有第一校正器，用于基于校正由于用于组装磁体和传感器的组装过程导致的误差的第一校正值和用于校正预校正机械角度的第二校正器来校正预校正机械角度 基于第二校正值，其校正由于通过向绕组线提供电流而产生的溢出磁通量的误差。 在这种构造中，旋转角度检测器可以校正由于溢出磁通量引起的误差，从而能够精确地检测机械角度。

公开(公告)号：US20160036303A1

公开(公告)日：2016-02-04

申请号：US14812769

申请日：2015-07-29

Applicant: DENSO CORPORATION

Inventor： Yuuta Kadoike ,  Hideki Kabune ,  Hiroyuki Kawata

IPC: H02K11/00 ,  B62D5/04 ,  H02K9/22

CPC classification number: H02K9/22 ,  B62D5/0406 ,  B62D5/0412 ,  H02K11/33

Abstract: A drive device that includes a motor having a rotor disposed relative to a stator, a cover having a one-end-closed cylinder shape and positioned on one axial end side of the motor, and a substrate on the inside of the cover perpendicular to a motor shaft having electronic components implemented on the substrate. The drive device also includes a connector positioned on a motor side of the substrate with an opening that is connectable to an external terminal. The opening of the connector faces outward relative to the motor shaft. The drive device further includes a heat sink having a frame end part and a heat receiving part formed in one body. The drive device increases heat capacity of the heat sink without increasing its height.

Abstract translation: 一种驱动装置，包括具有相对于定子设置的转子的电动机，具有一端闭合圆筒形并且位于所述电动机的一个轴向端侧的盖，以及垂直于所述电动机的所述盖的内侧的基板 电机轴具有在基板上实现的电子部件。 驱动装置还包括位于基板的马达侧的连接器，该连接器具有可连接到外部端子的开口。 连接器的开口相对于电机轴向外面。 驱动装置还包括具有框架端部和形成在一体内的受热部的散热器。 驱动装置增加散热器的热容量而不增加散热器的高度。