公开(公告)号：US11929303B2

公开(公告)日：2024-03-12

申请号：US16973035

申请日：2019-06-19

Applicant: Dexerials Corporation

Inventor： Yusuke Kubo ,  Sergey Bolotov

IPC: H01L21/56 ,  H01L23/367 ,  H01L23/373 ,  H01L23/433

CPC classification number: H01L23/4334 ,  H01L21/56 ,  H01L23/367 ,  H01L23/3733

Abstract: Provided is a semiconductor device having excellent heat dissipation capacity and electromagnetic wave suppression effect. A semiconductor device 1 includes a semiconductor element 30; a conductive cooling member 40 provided above the semiconductor element 30, a conductive thermally conductive member 10 that is provided between the semiconductor element 30 and the cooling member 40 and contains a cured resin. The conductive thermally conductive member 10 is connected to a ground 60 in the substrate 50 to electrically connect the cooling member 40 and the ground 60.

公开(公告)号：US11329005B2

公开(公告)日：2022-05-10

申请号：US16973765

申请日：2019-06-19

Applicant: Dexerials Corporation

Inventor： Sergey Bolotov ,  Yusuke Kubo

IPC: H01L23/552 ,  H01L23/367 ,  H01L23/373 ,  H01L21/48

Abstract: Provided is a semiconductor device having excellent heat dissipation capacity and electromagnetic wave suppression effect. A semiconductor device 1 includes a semiconductor device 30; a tubular conductive shield can 20 provided to surround a side surface 30a of the semiconductor device 30; a conductive cooling member 40; and a conductive thermally conductive sheet 10 formed between the semiconductor device 30 and the cooling member 40. The conductive shield can 20 and the cooling member 40 are electrically connected through the conductive thermally conductive sheet 10 therebetween.

公开(公告)号：US11315889B2

公开(公告)日：2022-04-26

申请号：US17053248

申请日：2019-06-18

Applicant: DEXERIALS CORPORATION

Inventor： Yusuke Kubo ,  Sergey Bolotov

IPC: H01L23/60 ,  H01L23/367 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01P3/08

Abstract: Provided is an electronic device capable of simultaneously achieving heat dissipation, electromagnetic wave suppression effect and ESD protection at a high level. The device includes: an electronic component 30 provided on a substrate 31; an electrically conductive shielding can 20 having an opening 21 and provided so as to surround the electronic component 30 and connected to a ground 32; an electrically conductive cooling member 40 provided on the top of the electrically conductive shielding can 20; a thermally and electrically conductive sheet 10 provided between the electronic component 30 and the electrically conductive cooling member 40; and an insulating member 50 provided between the thermally and electrically conductive sheet 10 and the electrically conductive cooling member 40 and facing the electronic component 30 through the opening 21, wherein the insulating member 50 has a size equal to or larger than the region of the electronic component 30 facing through the opening 21, and the electrically conductive shielding can 20 and the electrically conductive cooling member 40 are electrically connected through the thermally and electrically conductive sheet 10.