公开(公告)号：US20230070488A1

公开(公告)日：2023-03-09

申请号：US17797855

申请日：2021-01-29

Applicant: DEXERIALS CORPORATION

Inventor： Ryo ITO ,  Yasunobu YAMADA ,  Daisuke SATO

IPC: H01R43/02 ,  H01R12/57

Abstract: A method for manufacturing a connection body capable of suppressing deformation of a connector having a terminal array with a narrow pitch and obtaining excellent insulation and conductivity, and the connection body. The method includes: a step of fixing, on a first terminal array of a substrate, via a thermosetting connection material containing solder particles, a connector having a second terminal array having a minimum inter-terminal distance of 0.8 mm or less in the first terminal array and the second terminal array inside a bonding surface to be bonded with the substrate, and a step of joining the first terminal array and the second terminal array without a load by using a reflow furnace set to a temperature equal to or higher than the melting point of the solder particles.

公开(公告)号：US20160316569A1

公开(公告)日：2016-10-27

申请号：US15104452

申请日：2014-12-10

Applicant: DEXERIALS CORPORATION

Inventor： Yasunobu YAMADA ,  Morio SEKIGUCHI ,  Susumu KUMAKURA

IPC: H05K3/22 ,  H05K3/32 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K3/225 ,  H05K1/0353 ,  H05K1/181 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2203/176

Abstract: A method for manufacturing a mounting body comprising: a mounting step of mounting an electronic component onto a wiring board via an anisotropic conductive film containing a binder having an epoxy resin as a primary constituent and conductive particles having a compressive hardness (K) of 500 kgf/mm2 or more when compressively deformed by 10%, wherein a relation between a thickness (A) of the binder and an average particle diameter (B) is 0.6≦B/A≦1.5 and an elastic modulus of the binder after curing is 50 MPa or more at 100° C.; and a remounting step of mechanically peeling to detach the electronic component and the wiring board in the case of a problem occurring in mounting of the mounting step and reusing the wiring board to perform the mounting step.

Abstract translation: 一种用于制造安装体的方法，包括：安装步骤，通过包含具有环氧树脂作为主要成分的粘合剂的各向异性导电膜和压缩硬度（K）为500kgf的导电颗粒将电子部件安装到布线板上 压缩变形10％时，粘合剂的厚度（A）与平均粒径（B）之间的关系为0.6≤B/A≤1.5，固化后的粘合剂的弹性模量为50 100℃以上MPa以上。 以及在安装安装步骤时发生问题的情况下机械剥离以拆卸电子部件和布线板的重新安装步骤，并重新使用布线板来执行安装步骤。