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    Via in a printed circuit board
    2.
    发明授权
    Via in a printed circuit board 有权
    通过印刷电路板

    公开(公告)号：US09398703B2

    公开(公告)日：2016-07-19

    申请号：US14281802

    申请日：2014-05-19

    申请人： Konstantine Karavakis ,  Kenneth S. Bahl

    发明人： Konstantine Karavakis ,  Kenneth S. Bahl

    IPC分类号： H05K1/03 ,  H05K3/38 ,  H05K3/42

    CPC分类号： H05K3/426 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/387 ,  H05K2201/0221 ,  H05K2201/0236 ,  H05K2203/0709 ,  Y10T29/49167

    摘要： A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material that has been covered with catalytic adhesive material on both faces of the dielectric laminate material. The layer of catalytic adhesive coats a portion of the dielectric laminate material around the hole. The patterned metal layer is placed over the catalytic adhesive material on both faces of the dielectric laminate material and within the hole.

    摘要翻译： 印刷电路板中的通孔由延伸穿过电介质层压材料中的孔的图案化金属层组成，该电介质层压材料已经在介电层压材料的两个表面上被催化粘合剂材料覆盖。 催化粘合剂层将电介质层叠材料的一部分涂覆在孔周围。 图案化的金属层放置在介电层压材料的两个表面上和孔内的催化粘合剂材料上。

    CONDUCTIVE MICROPARTICLES
    4.
    发明申请
    CONDUCTIVE MICROPARTICLES 审中-公开
    导电微量元素

    公开(公告)号：US20150318067A1

    公开(公告)日：2015-11-05

    申请号：US14651788

    申请日：2014-01-14

    申请人： TORAY INDUSTRIES, INC.

    发明人： Itaru Asano ,  Ayano Ohno ,  Hiroshi Takezaki

    IPC分类号： H01B1/02 ,  C08K3/28

    CPC分类号： H01B1/02 ,  C08K3/28 ,  C08K9/02 ,  C09J9/02 ,  C09J11/00 ,  H05K1/095 ,  H05K1/189 ,  H05K3/321 ,  H05K2201/0221

    摘要： Conductive microparticles, each are composed of a polymer microparticle and a conductive layer formed by coating the surface of the polymer microparticle with a metal. The conductive microparticles have an elastic modulus (E) at 5% displacement of 1-100 MPa. Especially when the conductive microparticles have a shape recovery ratio (SR) of 0.1-13% under a load of 9.8 mN, a particle size distribution index of 1-3 and a particle size of 0.1-100 μm, the conductive microparticles can exhibit excellent conduction reliability in applications such as conductive adhesives for flexible boards.

    摘要翻译： 导电性微粒由聚合物微粒和通过用金属涂布聚合物微粒的表面形成的导电层构成。 导电性微粒在1〜100MPa的5％位移下具有弹性模量（E）。 特别是当导电性微粒在9.8mN的负载下的形状恢复率（SR）为0.1〜13％，粒径分布指数为1-3，粒径为0.1〜100μm的情况下，导电性微粒可显示优异的 用于柔性板的导电粘合剂等应用中的传导可靠性。

    Conductive particles and method of preparing the same
    5.
    发明授权
    Conductive particles and method of preparing the same 有权
    导电颗粒及其制备方法

    公开(公告)号：US09093196B2

    公开(公告)日：2015-07-28

    申请号：US11863379

    申请日：2007-09-28

    申请人： Toshifumi Hashiba ,  Kazutoshi Hayakawa ,  Satomi Kudo ,  Kohei Moriyama ,  Tsuyoshi Fujii

    发明人： Toshifumi Hashiba ,  Kazutoshi Hayakawa ,  Satomi Kudo ,  Kohei Moriyama ,  Tsuyoshi Fujii

    IPC分类号： H01B1/00 ,  H01B1/20 ,  C08J3/12 ,  H01B1/12 ,  H05K3/32

    CPC分类号： H01B1/20 ,  C08J3/12 ,  C08J3/126 ,  C08J2333/20 ,  H01B1/128 ,  H05K3/321 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/2998

    摘要： Conductive particles each includes a polymer base particle and a conductive layer coating the polymer base particle. Let the compressive elastic deformation characteristic KX of one conductive particle when the displacement of particle diameter of the conductive particles is X % be defined by the following formula: KX=(3/√2)·(SX−3/2)·(R−1/2)·FX. FX is the load (N) necessary for X % displacement of the conductive particles. SX is the compressive deformation amount (mm) upon X % displacement of the conductive particles. R is the particle radius (mm) of the conductive particles. The compressive elastic deformation characteristic K50 when the displacement of particle diameter of the conductive particles is 50% is 100 to 50000 N/mm2 at 20° C., and the recovery factor of particle diameter of the conductive particles when the displacement of particle diameter of the conductive particles is 50% is not less than 30% at 20° C.

    摘要翻译： 导电粒子各自包含聚合物基体颗粒和涂覆聚合物基础颗粒的导电层。 使导电粒子的粒径的位移为X％时的一个导电性粒子的压缩弹性变形特性KX由下式定义：KX =（3 /√2）·（SX-3/2）·（R -1/2）·FX。 FX是导电颗粒的X％位移所需的载荷（N）。 SX是导电颗粒的X％位移时的压缩变形量（mm）。 R是导电粒子的粒子半径（mm）。 导电粒子的粒径为50％时的压缩弹性变形特性K50在20℃为100〜50000N / mm 2，当导电粒子的粒径移动时的导电粒子的粒径的回收率 导电颗粒在20℃下为50％不小于30％

    Conductive compositions containing blended alloy fillers
    10.
    发明授权
    Conductive compositions containing blended alloy fillers 有权
    含有混合合金填料的导电组合物

    公开(公告)号：US08221518B2

    公开(公告)日：2012-07-17

    申请号：US12751030

    申请日：2010-03-31

    申请人： Catherine Shearer ,  Kenneth C. Holcomb ,  G. Delbert Friesen ,  Michael C. Matthews

    发明人： Catherine Shearer ,  Kenneth C. Holcomb ,  G. Delbert Friesen ,  Michael C. Matthews

    IPC分类号： B22F1/00 ,  B23K31/00

    CPC分类号： B22F1/0003 ,  B22F1/0059 ,  B22F7/064 ,  H05K3/321 ,  H05K2201/0221 ,  H05K2201/0272

    摘要： The present invention provides electrically and thermally conductive compositions for forming interconnections between electronic elements. Invention compositions comprise three or more metal or metal alloy particle types and an organic vehicle comprising a flux that is application specific. The first particle type includes a reactive high melting point metal that reacts with a reactive low melting point metal(s) in the other particles to form intermetallic species. The reactive low melting point metal(s) of the invention are provided in two distinct particle forms. The first reactive low melting point metal particle includes a carrier that facilitates the reaction with the reactive high melting point metal. The second reactive low melting point metal particle acts primarily as a source of the reactive low melting point metal. Combination of the three particle types provides several advantages including reduction of the undesirable characteristics of the carrier metal while preserving and, in some embodiments, enhancing, the advantageous facilitation of the metallic reaction.

    摘要翻译： 本发明提供用于形成电子元件之间的互连的导电和导热组合物。 本发明组合物包含三种或更多种金属或金属合金颗粒类型和包含特异性应用的助熔剂的有机载体。 第一颗粒型包括与其它颗粒中的反应性低熔点金属反应以形成金属间物质的反应性高熔点金属。 本发明的反应性低熔点金属以两种不同的颗粒形式提供。 第一反应性低熔点金属颗粒包括促进与反应性高熔点金属反应的载体。 第二反应性低熔点金属颗粒主要作为反应性低熔点金属的来源。 三种颗粒类型的组合提供了几个优点，包括减少载体金属的不期望的特性，同时保留并且在一些实施方案中增强对金属反应的有利促进。