公开(公告)号：US20230070488A1

公开(公告)日：2023-03-09

申请号：US17797855

申请日：2021-01-29

Applicant: DEXERIALS CORPORATION

Inventor： Ryo ITO ,  Yasunobu YAMADA ,  Daisuke SATO

IPC: H01R43/02 ,  H01R12/57

Abstract: A method for manufacturing a connection body capable of suppressing deformation of a connector having a terminal array with a narrow pitch and obtaining excellent insulation and conductivity, and the connection body. The method includes: a step of fixing, on a first terminal array of a substrate, via a thermosetting connection material containing solder particles, a connector having a second terminal array having a minimum inter-terminal distance of 0.8 mm or less in the first terminal array and the second terminal array inside a bonding surface to be bonded with the substrate, and a step of joining the first terminal array and the second terminal array without a load by using a reflow furnace set to a temperature equal to or higher than the melting point of the solder particles.

公开(公告)号：US20190085211A1

公开(公告)日：2019-03-21

申请号：US16189165

申请日：2018-11-13

Applicant: DEXERIALS CORPORATION

Inventor： Ryosuke ODAKA ,  Daisuke SATO

IPC: C09J4/00 ,  C08F220/32 ,  C09J163/10

Abstract: Provided are an adhesive agent capable of providing sufficient electrical continuity to a substrate to which a preflux treatment has been applied and a method for connecting electronic components. There is used an adhesive agent comprising a (meth)acrylate having an epoxy group in one molecule and a radical polymerization initiator having a one minute half-life temperature of 110 degrees C. or more. A surplus adhesive agent component between terminals flows, whereby an imidazole component in a preflux, the component binding to an epoxy group of an epoxy group-containing acrylate, is drawn out thereby to be removed from a surface of the terminal.

公开(公告)号：US20190053383A1

公开(公告)日：2019-02-14

申请号：US16077785

申请日：2017-03-27

Applicant: DEXERIALS CORPORATION

Inventor： Daisuke SATO ,  Akifumi HIGUCHI

IPC: H05K3/32 ,  H05K3/36 ,  H01B5/16

Abstract: There is provided a new and improved anisotropic conductive connection structure body that reduces the connection resistance of an anisotropic conductive connection portion between electrode terminals and can enhance reliability, and can enhance the connection strength. The anisotropic conductive connection structure body includes: a first electrode terminal on a surface of which a protruding portion is formed; a second electrode terminal; and an anisotropic conductive adhesive layer containing electrically conductive particles that provide conduction between the first electrode terminal and the second electrode terminal. A ratio of a height of the protruding portion to a before-compression particle size of the electrically conductive particle is less than 60%, an opening area ratio of the first electrode terminal is more than or equal to 55%, and a height of the second electrode terminal is more than or equal to 6 μm.

公开(公告)号：US20230198186A1

公开(公告)日：2023-06-22

申请号：US17910987

申请日：2021-03-18

Applicant: DEXERIALS CORPORATION

Inventor： Ryosuke ODAKA ,  Ryo ITO ,  Hiroyuki KUMAKURA ,  Tomoyuki ABE ,  Daisuke SATO ,  Katsuhisa ORIHARA ,  Kazuhisa AOKI

IPC: H01R13/405 ,  H01R4/04 ,  H01R12/71 ,  H01R43/02

CPC classification number: H01R13/405 ,  H01R4/04 ,  H01R12/71 ,  H01R43/02

Abstract: A connection body capable of achieving fine pitch and miniaturization, and a method of manufacturing the connection body. A connection body includes: a substrate having a first terminal array; a connector having second terminal array; and an adhesive layer formed by curing a thermosetting connection material connecting the first terminal array and the second terminal array, wherein the second terminal array is disposed on the bottom surface of the connector and forms a level difference canceling portion for canceling a level difference in the bottom surface, and wherein the thermosetting connection material contains solder particles and a flux component. Thus, the first terminal array and the second terminal array can be connected, so that the terminal array can be made to have a fine pitch, and the connected body can be miniaturized.

公开(公告)号：US20160260683A1

公开(公告)日：2016-09-08

申请号：US15155228

申请日：2016-05-16

Applicant: Dexerials Corporation

Inventor： Kazunori HAMAZAKI ,  Takashi MATSUMURA ,  Daisuke SATO ,  Yasuhiro SUGA

IPC: H01L23/00

CPC classification number: H01L24/92 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/13017 ,  H01L2224/13144 ,  H01L2224/14135 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1623 ,  H01L2224/16238 ,  H01L2224/27334 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/32012 ,  H01L2224/32225 ,  H01L2224/3224 ,  H01L2224/73103 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81444 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/364 ,  H01L2924/381 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012

Abstract: A semiconductor device includes a semiconductor chip provided with a plurality of bumps arranged in a peripheral alignment, a substrate provided with a plurality of electrodes, and an insulating resin adhesive film. The semiconductor chip is affixed to the substrate via the insulating resin adhesive film such that the electrodes are in positions corresponding to the positions of the bumps. The insulating resin adhesive film has a minimum melt viscosity of 8×103 to 1×105 Pa·s, covers 70 to 90% the area of the region enclosed with the plurality of bumps, and heat cured. The bumps and the electrodes corresponding thereto are arranged so that they are opposed to each other and establish metallic contact therebetween. A periphery of the insulating resin adhesive film is defined between the plurality of bumps and the outer edge of the semiconductor chip, exclusive.

Abstract translation: 半导体器件包括设置有周向排列的多个凸块的半导体芯片，设置有多个电极的基板和绝缘树脂粘合膜。 半导体芯片通过绝缘树脂粘合膜固定到基板上，使得电极处于与凸块的位置对应的位置。 绝缘树脂粘合膜的最小熔融粘度为8×10 3〜1×10 5 Pa·s，覆盖多个凸起所包围的区域的面积为70〜90％，并进行热固化。 凸起和对应的电极被布置成使得它们彼此相对并且在它们之间建立金属接触。 绝缘树脂粘合膜的周边被限定在多个凸块和半导体芯片的外边缘之间。

公开(公告)号：US20140251537A1

公开(公告)日：2014-09-11

申请号：US14278810

申请日：2014-05-15

Applicant: Dexerials Corporation

Inventor： Daisuke SATO ,  Junichi NISHIMURA ,  Ryosuke ODAKA

IPC: H05K3/30

CPC classification number: H05K3/30 ,  C08K3/01 ,  C09J7/35 ,  C09J163/00 ,  C09J2201/134 ,  C09J2205/102 ,  C09J2463/00 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29366 ,  H01L2224/29386 ,  H01L2224/83101 ,  H01L2224/83194 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15788 ,  H05K3/305 ,  H05K2201/0195 ,  H05K2201/0209 ,  Y02P70/613 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/05042 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: To provide an insulating resin film, which contains: a first adhesive layer; and a second adhesive layer, wherein the insulating resin film is configured to bond a substrate and an electronic part together, and the first adhesive layer is provided at a side of the substrate and the second adhesive layer is provided at a side of the electronic part, wherein the first adhesive layer and the second adhesive layer each contain inorganic filler, wherein the second adhesive layer has a DSC exothermic peak temperature that is higher than a DSC exothermic peak temperature of the first adhesive layer, and wherein a thickness of the first adhesive layer is 50% to 90% of a total thickness of the insulating resin film.

Abstract translation: 提供绝缘树脂膜，其包含：第一粘合剂层; 和第二粘合剂层，其中所述绝缘树脂膜被构造成将基板和电子部件结合在一起，并且所述第一粘合层设置在所述基板的一侧，并且所述第二粘合层设置在所述电子部件的一侧 其中，所述第一粘合剂层和所述第二粘合剂层各自含有无机填料，其中所述第二粘合剂层具有比所述第一粘合剂层的DSC放热峰值温度高的DSC放热峰值温度，并且其中所述第一粘合剂的厚度 层是绝缘树脂膜的总厚度的50％至90％。

公开(公告)号：US20230159797A1

公开(公告)日：2023-05-25

申请号：US18098412

申请日：2023-01-18

Applicant: DEXERIALS CORPORATION

Inventor： Daisuke SATO ,  Yasushi AKUTSU ,  Ryousuke ODAKA ,  Yusuke TANAKA

IPC: C09J9/02 ,  C09J7/10 ,  H05K3/32 ,  H04N23/54 ,  H01B1/22 ,  C09J11/04 ,  C09J163/00 ,  H01L27/146 ,  H01R4/04 ,  H05K1/18

CPC classification number: C09J9/02 ,  C09J7/10 ,  H05K3/323 ,  H04N23/54 ,  H01B1/22 ,  C09J11/04 ,  C09J163/00 ,  H01L27/14618 ,  H01R4/04 ,  H05K1/181 ,  C08K3/08

Abstract: An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.

公开(公告)号：US20180002575A1

公开(公告)日：2018-01-04

申请号：US15541881

申请日：2016-01-13

Applicant: DEXERIALS CORPORATION

Inventor： Daisuke SATO ,  Yasushi AKUTSU ,  Ryousuke ODAKA ,  Yusuke TANAKA

IPC: C09J9/02 ,  H04N5/225 ,  H05K1/18 ,  C09J11/04 ,  H01B1/22 ,  H01L27/146 ,  H01R4/04 ,  C09J163/00 ,  C08K3/10 ,  C08K3/36 ,  C08K9/02 ,  H05K1/02

Abstract: An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.