公开(公告)号：US20220363953A1

公开(公告)日：2022-11-17

申请号：US17623928

申请日：2021-06-03

Applicant: DEXERIALS CORPORATION

Inventor： Ryosuke ODAKA ,  Morio SEKIGUCHI ,  Hiroyuki KUMAKURA ,  Tomoyuki ABE

IPC: C09J7/35 ,  C09J5/06 ,  C09J9/02 ,  C09J7/10 ,  G06K19/077 ,  B29C65/48 ,  B29C65/00

Abstract: A method for manufacturing a smart card capable of achieving excellent connection reliability and bending resistance, a smart card, and a conductive particle-containing hot-melt adhesive sheet. A conductive particle-containing hot-melt adhesive sheet containing solder particles of a non-eutectic alloy in a binder containing a crystalline polyamide having a carboxyl group is interposed between a card member and an IC chip and subjected to thermocompression bonding. The crystalline polyamide having a carboxyl group improves the solder wettability of the non-eutectic alloy, thereby achieving excellent connection reliability. This effect is considered to be a flux effect due to the carboxyl group present in the crystalline polyamide, and as a result, it is possible to prevent the decrease in the elastic modulus of the adhesive layer which would be caused by the addition of a flux compound and to achieve excellent bending resistance.

公开(公告)号：US20160316569A1

公开(公告)日：2016-10-27

申请号：US15104452

申请日：2014-12-10

Applicant: DEXERIALS CORPORATION

Inventor： Yasunobu YAMADA ,  Morio SEKIGUCHI ,  Susumu KUMAKURA

IPC: H05K3/22 ,  H05K3/32 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K3/225 ,  H05K1/0353 ,  H05K1/181 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2203/176

Abstract: A method for manufacturing a mounting body comprising: a mounting step of mounting an electronic component onto a wiring board via an anisotropic conductive film containing a binder having an epoxy resin as a primary constituent and conductive particles having a compressive hardness (K) of 500 kgf/mm2 or more when compressively deformed by 10%, wherein a relation between a thickness (A) of the binder and an average particle diameter (B) is 0.6≦B/A≦1.5 and an elastic modulus of the binder after curing is 50 MPa or more at 100° C.; and a remounting step of mechanically peeling to detach the electronic component and the wiring board in the case of a problem occurring in mounting of the mounting step and reusing the wiring board to perform the mounting step.

Abstract translation: 一种用于制造安装体的方法，包括：安装步骤，通过包含具有环氧树脂作为主要成分的粘合剂的各向异性导电膜和压缩硬度（K）为500kgf的导电颗粒将电子部件安装到布线板上 压缩变形10％时，粘合剂的厚度（A）与平均粒径（B）之间的关系为0.6≤B/A≤1.5，固化后的粘合剂的弹性模量为50 100℃以上MPa以上。 以及在安装安装步骤时发生问题的情况下机械剥离以拆卸电子部件和布线板的重新安装步骤，并重新使用布线板来执行安装步骤。