Copper-nickel alloy electroplating device

    公开(公告)号:US10538854B2

    公开(公告)日:2020-01-21

    申请号:US15519474

    申请日:2015-06-25

    摘要: Provided is a copper-nickel alloy electroplating apparatus which is capable of stably forming a copper-nickel plated coating on a workpiece with a uniform composition and which enables a plating bath to be used for a long period. The present invention provides a copper-nickel alloy electroplating apparatus (1), comprising: a cathode chamber (4) in which a workpiece (5) is to be placed; an anode chamber (6); an anode (7) placed in the anode chamber; an electrically conductive diaphragm (14) placed to separate the cathode chamber and the anode chamber from each other; a cathode chamber oxidation-reduction potential adjusting tank (8) for adjusting the oxidation-reduction potential of a plating liquid in the cathode chamber; an anode chamber oxidation-reduction potential adjusting tank (10) for adjusting the oxidation-reduction potential of a plating liquid in the anode chamber; and a power supply unit (36) that provides an electric current to flow between the workpiece and the anode.

    Zinc alloy plating method
    4.
    发明授权

    公开(公告)号:US10156020B2

    公开(公告)日:2018-12-18

    申请号:US14782671

    申请日:2015-07-22

    IPC分类号: C25D3/56 C25D17/00

    摘要: The present invention provides a zinc alloy electroplating method comprising applying a current through an alkaline zinc alloy electroplating bath comprising a cathode and an anode, wherein a cathode region including the cathode and an anode region including the anode are separated from each other by an anion exchange membrane, a catholyte contained in the cathode region is an alkaline zinc alloy plating liquid, and an anolyte contained in the anode region is an aqueous alkaline solution.