公开(公告)号：US20220020614A1

公开(公告)日：2022-01-20

申请号：US17371720

申请日：2021-07-09

Applicant: DISCO CORPORATION

Inventor： Yukiyasu MASUDA ,  Yoshikuni MIGIYAMA ,  Takashi UCHIHO ,  Ryosuke KUROSAWA ,  Toshiyuki YOSHIKAWA ,  Toshio TSUCHIYA ,  Masanobu TAKENAKA ,  Tomoyuki HONGO ,  Takashi MORI ,  Yoshinori KAKINUMA ,  Yoshinobu SAITO ,  Jonghyun RYU

IPC: H01L21/67 ,  H01L21/683

Abstract: A processing apparatus includes a wafer conveying-out mechanism; a wafer table; a frame conveying-out mechanism; a frame table; a tape attaching mechanism that attaches a tape to a frame; a tape-attached frame conveying mechanism that conveys the tape-attached frame; a tape pressure bonding mechanism that pressure bonds the tape of the tape-attached frame to a back surface of a wafer; a frame unit conveying-out mechanism that conveys out a frame unit in which the tape of the tape-attached frame and the back surface of the wafer are pressure bonded; a reinforcement section removing mechanism that cuts and removes a ring-shaped reinforcement section from the wafer; a ringless unit conveying-out mechanism that conveys out a ringless unit from which the reinforcement section has been removed; and a frame cassette table on which a frame cassette accommodating the ringless unit is to be placed.

公开(公告)号：US20220270910A1

公开(公告)日：2022-08-25

申请号：US17651104

申请日：2022-02-15

Applicant: DISCO CORPORATION

Inventor： Yoshinori KAKINUMA ,  Yoshinobu SAITO ,  Yukiyasu MASUDA ,  Toshiyuki YOSHIKAWA ,  Toshio TSUCHIYA ,  Masanobu TAKENAKA ,  Tomoyuki HONGO

IPC: H01L21/683 ,  H01L21/677 ,  B23K26/364 ,  B23K26/402

Abstract: A processing apparatus includes a wafer carrying-out unit, a wafer table that supports a wafer carried out, a frame carrying-out unit, a frame table that supports an annular frame carried out, a tape sticking unit that sticks a tape to the annular frame, a tape-attached frame conveying unit, a tape pressure bonding unit that executes pressure bonding of the tape of a tape-attached frame to the back surface of the wafer, a frame unit carrying-out unit, and a reinforcing part removing unit that cuts and removes a ring-shaped reinforcing part from the wafer of a frame unit.

公开(公告)号：US20210060697A1

公开(公告)日：2021-03-04

申请号：US17003529

申请日：2020-08-26

Applicant: DISCO CORPORATION

Inventor： Hiroki TAKEUCHI ,  Masanobu TAKENAKA ,  Yukito AKUTAGAWA

IPC: B23K26/0622 ,  B23K26/035

Abstract: There is provided a method of determining whether or not a result of a processing process of a laser processing apparatus is acceptable including a laser processing step of applying a laser beam to predetermined processing regions of a workpiece held on a chuck table, thereby performing a piercing process on the workpiece, an image capturing step of capturing images of all the processing regions while moving the image capturing unit and the workpiece relatively to each other, a detecting step of detecting regions where light is not transmitted through the workpiece among the processing regions in the image captured in the image capturing step, and a determining step of determining that the laser processing apparatus needs to be readjusted if the regions where light is not transmitted through the workpiece is equal to or more than the predetermined quantity.