公开(公告)号：US20220020614A1

公开(公告)日：2022-01-20

申请号：US17371720

申请日：2021-07-09

Applicant: DISCO CORPORATION

Inventor： Yukiyasu MASUDA ,  Yoshikuni MIGIYAMA ,  Takashi UCHIHO ,  Ryosuke KUROSAWA ,  Toshiyuki YOSHIKAWA ,  Toshio TSUCHIYA ,  Masanobu TAKENAKA ,  Tomoyuki HONGO ,  Takashi MORI ,  Yoshinori KAKINUMA ,  Yoshinobu SAITO ,  Jonghyun RYU

IPC: H01L21/67 ,  H01L21/683

Abstract: A processing apparatus includes a wafer conveying-out mechanism; a wafer table; a frame conveying-out mechanism; a frame table; a tape attaching mechanism that attaches a tape to a frame; a tape-attached frame conveying mechanism that conveys the tape-attached frame; a tape pressure bonding mechanism that pressure bonds the tape of the tape-attached frame to a back surface of a wafer; a frame unit conveying-out mechanism that conveys out a frame unit in which the tape of the tape-attached frame and the back surface of the wafer are pressure bonded; a reinforcement section removing mechanism that cuts and removes a ring-shaped reinforcement section from the wafer; a ringless unit conveying-out mechanism that conveys out a ringless unit from which the reinforcement section has been removed; and a frame cassette table on which a frame cassette accommodating the ringless unit is to be placed.

公开(公告)号：US20220270910A1

公开(公告)日：2022-08-25

申请号：US17651104

申请日：2022-02-15

Applicant: DISCO CORPORATION

Inventor： Yoshinori KAKINUMA ,  Yoshinobu SAITO ,  Yukiyasu MASUDA ,  Toshiyuki YOSHIKAWA ,  Toshio TSUCHIYA ,  Masanobu TAKENAKA ,  Tomoyuki HONGO

IPC: H01L21/683 ,  H01L21/677 ,  B23K26/364 ,  B23K26/402

Abstract: A processing apparatus includes a wafer carrying-out unit, a wafer table that supports a wafer carried out, a frame carrying-out unit, a frame table that supports an annular frame carried out, a tape sticking unit that sticks a tape to the annular frame, a tape-attached frame conveying unit, a tape pressure bonding unit that executes pressure bonding of the tape of a tape-attached frame to the back surface of the wafer, a frame unit carrying-out unit, and a reinforcing part removing unit that cuts and removes a ring-shaped reinforcing part from the wafer of a frame unit.

公开(公告)号：US20220108882A1

公开(公告)日：2022-04-07

申请号：US17447847

申请日：2021-09-16

Applicant: DISCO CORPORATION

Inventor： Toshio TSUCHIYA ,  Toshiyuki YOSHIKAWA ,  Tomoyuki HONGO

IPC: H01L21/02 ,  G02B26/10 ,  H01L21/683 ,  H01L21/268 ,  B23K26/50

Abstract: A processing method of a workpiece with a circular disc shape includes sticking a tape to one surface of the workpiece and integrating the workpiece and a frame through the tape, holding the workpiece by a holding unit with the interposition of the tape, and irradiating the other surface of the workpiece located on the opposite side to the one surface with a pulsed laser beam having such a wavelength as to be absorbed by the workpiece from the side of the other surface. In irradiating the laser beam, the other surface is annularly irradiated with the laser beam in the state in which the orientation of the laser beam is adjusted in such a manner that the laser beam has an angle of incidence formed due to inclination with respect to a normal to the other surface of the workpiece by a predetermined angle.