公开(公告)号：US20230121008A1

公开(公告)日：2023-04-20

申请号：US18047445

申请日：2022-10-18

Applicant: DISCO CORPORATION

Inventor： Takashi MORI ,  Yoshinori KAKINUMA ,  Jonghyun RYU ,  Mitsuru IKUSHIMA ,  Makoto SAITO ,  Yohei MASUDA ,  Takashi UCHIHO ,  Yoshinobu SAITO

IPC: H01L21/683 ,  H01L21/67 ,  B23K26/364

Abstract: A processing apparatus includes a wafer table that supports a wafer, a frame table that supports an annular frame, a first tape pressure bonding unit that includes a first pressure bonding roller for executing pressure bonding of a tape to the annular frame, and a second tape pressure bonding unit that includes a second pressure bonding roller for executing pressure bonding of the tape of the tape-attached annular frame to a front surface or a back surface of the wafer. A first heating unit is disposed in one of or both the frame table and the first pressure bonding roller, while a second heating unit is disposed in one of or both the wafer table and the second pressure bonding roller.

公开(公告)号：US20220189800A1

公开(公告)日：2022-06-16

申请号：US17455136

申请日：2021-11-16

Applicant: DISCO CORPORATION

Inventor： Takashi UCHIHO ,  Yoshinori KAKINUMA

IPC: H01L21/67 ,  B23K26/402

Abstract: A processing apparatus includes a tape pressure bonding unit that executes pressure bonding of a tape of a tape-attached frame to a back surface of a wafer. The tape pressure bonding unit includes an upper chamber, a lower chamber, a raising-lowering mechanism that raises and lowers the upper chamber, a vacuum part that sets the upper chamber and the lower chamber to a vacuum state, and an opening-to-atmosphere part that opens the upper chamber and the lower chamber to the atmosphere.

公开(公告)号：US20230154782A1

公开(公告)日：2023-05-18

申请号：US18053861

申请日：2022-11-09

Applicant: DISCO CORPORATION

Inventor： Takashi UCHIHO ,  Yoshinobu SAITO ,  Yoshinori KAKINUMA

IPC: H01L21/683 ,  H01L21/687

CPC classification number: H01L21/6836 ,  H01L21/6838 ,  H01L21/68742

Abstract: A tape pressure bonding apparatus includes an upper chamber, a lower chamber, a lifting mechanism that switches between a closed state in which the upper chamber is moved downward to be brought into contact with the lower chamber and an open state in which the upper chamber is separated from the lower chamber, a vacuum section that evacuates the upper chamber and the lower chamber, and an atmosphere opening section that opens the upper chamber and the lower chamber to the atmosphere. The lower chamber accommodates a wafer table that has a holding surface including a circular recess for supporting only a peripheral surplus region of the wafer and making a device region in a non-contact state. The tape pressure bonding apparatus includes a positive pressure generating section that supplies air into the circular recess of the wafer table to establish a positive pressure state in the circular recess.

公开(公告)号：US20230093583A1

公开(公告)日：2023-03-23

申请号：US17931693

申请日：2022-09-13

Applicant: DISCO CORPORATION

Inventor： Takashi UCHIHO ,  Yoshinobu SAITO ,  Jonghyun RYU

IPC: B65H37/04 ,  B65H18/10 ,  B65H35/00

Abstract: A tape affixing apparatus includes a frame support table for supporting an annular frame, a lifting and lowering unit for lifting and lowering the frame support table, a tape affixing unit, and a controller. The tape affixing unit includes a tape uncoiler, a tape take-up reel, and a presser roller movable from one end to the other end of the annular frame supported on the frame support table while pressing a tape paid out from the tape uncoiler to affix the tape to the annular frame. The controller positions the presser roller in a pressing position, affixes the tape to one end of the annular frame while applying tension to the tape, moves the presser roller toward the other end of the annular frame, and keeps the tension on the tape constant by lifting the frame support table in synchronism with the presser roller as it is moved.

公开(公告)号：US20220020614A1

公开(公告)日：2022-01-20

申请号：US17371720

申请日：2021-07-09

Applicant: DISCO CORPORATION

Inventor： Yukiyasu MASUDA ,  Yoshikuni MIGIYAMA ,  Takashi UCHIHO ,  Ryosuke KUROSAWA ,  Toshiyuki YOSHIKAWA ,  Toshio TSUCHIYA ,  Masanobu TAKENAKA ,  Tomoyuki HONGO ,  Takashi MORI ,  Yoshinori KAKINUMA ,  Yoshinobu SAITO ,  Jonghyun RYU

IPC: H01L21/67 ,  H01L21/683

Abstract: A processing apparatus includes a wafer conveying-out mechanism; a wafer table; a frame conveying-out mechanism; a frame table; a tape attaching mechanism that attaches a tape to a frame; a tape-attached frame conveying mechanism that conveys the tape-attached frame; a tape pressure bonding mechanism that pressure bonds the tape of the tape-attached frame to a back surface of a wafer; a frame unit conveying-out mechanism that conveys out a frame unit in which the tape of the tape-attached frame and the back surface of the wafer are pressure bonded; a reinforcement section removing mechanism that cuts and removes a ring-shaped reinforcement section from the wafer; a ringless unit conveying-out mechanism that conveys out a ringless unit from which the reinforcement section has been removed; and a frame cassette table on which a frame cassette accommodating the ringless unit is to be placed.