公开(公告)号：US10935957B2

公开(公告)日：2021-03-02

申请号：US16376347

申请日：2019-04-05

申请人： DISCO CORPORATION

发明人： Keiji Kashiwagi ,  Satoshi Miyata

IPC分类号： G05B19/402

摘要： A cutting apparatus includes a chuck table that holds a workpiece, a processing unit that forms a processed groove in the workpiece, an imaging unit that images the workpiece, a display unit that displays a captured image of a processed groove imaged by the imaging unit, and a control unit that executes display control of a display screen of the display unit. The control unit causes a mark that indicates the latest processed groove based on the Y-coordinate of the latest processed groove to be displayed on the display unit while being superimposed on a captured image.

公开(公告)号：US11140335B2

公开(公告)日：2021-10-05

申请号：US17143373

申请日：2021-01-07

申请人： DISCO CORPORATION

发明人： Takafumi Omori ,  Satoshi Miyata

IPC分类号： H04N5/235 ,  H04N5/232

摘要： A method of adjusting the brightness of an illuminator in a processing apparatus includes, by a first processing apparatus, storing a sample image obtained by photographing a workpiece with a brightness specified by a first control value, together with the first control value, copying the sample image, the first control value and a processing condition to a second processing apparatus, by the second processing apparatus, storing a plurality of comparative images obtained by photographing the workpiece with brightnesses specified by a plurality of different control values, identifying a control value at a time of photographing a comparative image having a minimum difference in brightness from the sample image as a second control value, by comparing the sample image with the plurality of comparative images, and setting a difference between the first and second control values as a correction value of the control value of the second processing apparatus.

公开(公告)号：US10811295B2

公开(公告)日：2020-10-20

申请号：US16298092

申请日：2019-03-11

申请人： DISCO CORPORATION

发明人： Satoshi Miyata

IPC分类号： H01L21/68 ,  H01L21/78 ,  G06T7/00 ,  G06T7/11 ,  G01B11/00 ,  B23K26/00 ,  H01L21/67

摘要： A positioning method includes an imaging step, a straight line storage step, a straight line registration step, and a positioning step. The imaging step captures an image of a region including a target or street on a workpiece. The straight line storage step detects and stores the coordinate positions of all predetermined straight lines in the region. The straight line registration step allows an operator to select a specific straight line in the target or on the street from all the straight lines and register the selected straight line. The positioning step positions a processing unit on the street in accordance with coordinate data concerning the straight line selected and registered in the straight line registration step.

公开(公告)号：US09653366B2

公开(公告)日：2017-05-16

申请号：US15080919

申请日：2016-03-25

申请人： DISCO CORPORATION

发明人： Satoshi Miyata ,  Makoto Tanaka ,  Sombat Chanvilai

IPC分类号： H01L21/304 ,  H01L21/66 ,  H01L21/78 ,  H01L21/683 ,  H01L21/67

CPC分类号： H01L22/20 ,  B28D5/0064 ,  B28D5/023 ,  H01L21/67092 ,  H01L21/6836 ,  H01L21/78 ,  H01L22/12 ,  H01L2221/68327

摘要： Disclosed herein is a method of dividing a wafer including an exposed area incising step of lowering a cutting blade to a preset lowered position for fully severing the wafer to cause the cutting blade to incise an exposed area of a wafer unit, an image capturing step of capturing an image of the exposed area which the cutting blade has incised in the exposed area incising step, with image capturing means, a determining step of determining whether or not it is possible to fully sever the wafer on the basis of the captured image in the image capturing step, and an adjusting step of increasing a distance by which to lower the cutting blade if it is determined that it is impossible to fully sever the wafer in the determining step.

公开(公告)号：US10816952B2

公开(公告)日：2020-10-27

申请号：US16287560

申请日：2019-02-27

申请人： DISCO CORPORATION

发明人： Satoshi Miyata

IPC分类号： G05B19/402 ,  G06F3/0488 ,  G06F3/0484 ,  G06T7/00 ,  G05B19/418

摘要： A control method for a processing apparatus includes the steps of suspending a processing operation of a processing unit during the formation of a processed groove and then imaging the processed groove by using an imaging unit to obtain a detected image, inspecting the condition of the processed groove according to the detected image, inputting a selected one of plural parameters into an input area displayed on a touch panel from an operator in adjusting the parameters to optimize inspection conditions, moving an input cursor from the input area according to the input of the selected parameter, and executing the inspection of the processed groove by using the selected parameter input in the input area.

公开(公告)号：US20160293501A1

公开(公告)日：2016-10-06

申请号：US15080919

申请日：2016-03-25

申请人： DISCO CORPORATION

发明人： Satoshi Miyata ,  Makoto Tanaka ,  Sombat Chanvilai

IPC分类号： H01L21/66 ,  H01L21/683 ,  H01L21/78

CPC分类号： H01L22/20 ,  B28D5/0064 ,  B28D5/023 ,  H01L21/67092 ,  H01L21/6836 ,  H01L21/78 ,  H01L22/12 ,  H01L2221/68327

摘要： Disclosed herein is a method of dividing a wafer including an exposed area incising step of lowering a cutting blade to a preset lowered position for fully severing the wafer to cause the cutting blade to incise an exposed area of a wafer unit, an image capturing step of capturing an image of the exposed area which the cutting blade has incised in the exposed area incising step, with image capturing means, a determining step of determining whether or not it is possible to fully sever the wafer on the basis of the captured image in the image capturing step, and an adjusting step of increasing a distance by which to lower the cutting blade if it is determined that it is impossible to fully sever the wafer in the determining step.

摘要翻译： 本文公开了一种将包括将切割刀片降低到预设降低位置的暴露区域切割步骤的晶片分割的方法，以完全切断晶片以使切割刀片切割晶片单元的暴露区域，图像捕获步骤 拍摄在所述曝光区域切割步骤中所述切割刀片已经切割的所述暴露区域的图像;以及图像捕获装置，确定步骤，基于所述图像中的所捕获的图像来确定是否可能完全切断所述晶片 图像捕获步骤，以及如果在确定步骤中确定不可能完全切断晶片，则增加用于降低切割刀片的距离的调整步骤。