公开(公告)号：US20210057225A1

公开(公告)日：2021-02-25

申请号：US16999513

申请日：2020-08-21

Applicant: DISCO CORPORATION

Inventor： Hideyuki SANDOH ,  Ichiro YAMAHATA ,  Tomotaka TABUCHI

IPC: H01L21/304 ,  H01L21/3065

Abstract: There is provided a wafer processing method for reducing a thickness of a wafer. The wafer has a front side and a back side opposite to the front side. The wafer has a device area where a plurality of devices are formed on the front side and a peripheral marginal area including a curved peripheral edge. A protective layer for covering the plural devices are formed on the front side in the device area. The wafer processing method includes a plasma etching step of supplying an etching gas in a plasma condition to the front side of the wafer by using the protective layer as a mask, thereby removing the peripheral marginal area including the curved peripheral edge, a protective member attaching step of attaching a protective member to the front side of the wafer, and a grinding step of grinding the back side of the wafer.

公开(公告)号：US20240058918A1

公开(公告)日：2024-02-22

申请号：US18363955

申请日：2023-08-02

Applicant: DISCO CORPORATION

Inventor： Junsoo WOO ,  Tomotaka TABUCHI

IPC: B24B7/22 ,  B24B41/06

CPC classification number: B24B7/228 ,  B24B41/068

Abstract: A chuck table manufacturing method capable of changing over the shape of a holding surface according to at least two workpieces different in area or shape includes a porous plate sticking step of sticking a frame body and a porous plate to each other while the porous plate is accommodated in a recess of the frame body with an upper surface of the porous plate being exposed, a groove forming step of forming, in the porous plate, a groove reaching a bottom surface of the recess, and a resin filling step of filling the groove with a liquid resin and curing the liquid resin.