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    HEAT DISSIPATION DEVICE
    1.
    发明申请
    HEAT DISSIPATION DEVICE 审中-公开
    散热装置

    公开(公告)号：US20100000715A1

    公开(公告)日：2010-01-07

    申请号：US12239839

    申请日：2008-09-29

    申请人： DONG-BO ZHENG ,  MENG FU ,  CHUN-CHI CHEN

    发明人： DONG-BO ZHENG ,  MENG FU ,  CHUN-CHI CHEN

    IPC分类号： F28F7/00

    CPC分类号： H01L23/4006 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipation device includes a base, a sleeve coupling with the base, and a fastener engaging with the base and the sleeve. The base defines a hole extending therethrough. The sleeve includes a first portion coupling with the hole of the base and a second portion extending from an end of the first portion. The second portion is located at a first side of the base. The fastener includes a body portion extending through the sleeve and the base, a head portion and a foot portion formed at two ends of the body portion, respectively. The head portion is located at the first side of the base. A spring member is compressed between the head portion and the second portion. A compressed length of the spring member is adjustable by adjusting a coupling length of the first portion with the hole of the base.

    摘要翻译： 散热装置包括基座，与基座连接的套筒以及与基座和套筒接合的紧固件。 底座限定了一个贯穿其中的孔。 套筒包括与基座的孔结合的第一部分和从第一部分的端部延伸的第二部分。 第二部分位于基部的第一侧。 紧固件包括分别延伸穿过套筒和底座的主体部分，分别形成在主体部分两端的头部部分和脚部部分。 头部位于基座的第一侧。 弹簧构件在头部和第二部分之间被压缩。 通过调节第一部分与基部的孔的联接长度来调节弹簧构件的压缩长度。

    HEAT DISSIPATION DEVICE WITH HEAT PIPES
    2.
    发明申请
    HEAT DISSIPATION DEVICE WITH HEAT PIPES 有权
    带热管的散热装置

    公开(公告)号：US20090107653A1

    公开(公告)日：2009-04-30

    申请号：US11926701

    申请日：2007-10-29

    申请人： LEI JIANG ,  DONG-BO ZHENG ,  MENG FU ,  CHUN-CHI CHEN

    发明人： LEI JIANG ,  DONG-BO ZHENG ,  MENG FU ,  CHUN-CHI CHEN

    IPC分类号： F28F7/00

    CPC分类号： F28D15/0233 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipation device includes a base for contacting with an electronic device, a fin set thermally contacting the base, a first heat pipe and a second heat pipe connecting the base and the fin set. The fin set has a bottom larger than the base and an upper portion apart from the bottom thereof. The first heat pipe has a flat top face thermally contacting the bottom of the fin set, comprising a first transferring portion thermally engaging with the base, and a second transferring portion extending from the first transferring portion and projecting beyond the base. The second heat pipe comprises an evaporation portion thermally engaging with the base, and a condensation portion extending from the evaporation portion and engaging with the upper portion of the fin set.

    摘要翻译： 散热装置包括用于与电子装置接触的基座，与基座热接触的翅片组，第一热管和连接基座和翅片组的第二热管。 翅片组具有比基部大的底部和与其底部分离的上部。 第一热管具有与翅片组的底部热接触的平坦顶面，包括与基部热接合的第一传递部分和从第一传递部分延伸并突出超出基部的第二传递部分。 第二热管包括与基座热接合的蒸发部分，以及从蒸发部分延伸并与翅片组的上部接合的冷凝部分。

    HEAT SINK ASSEMBLY HAVING CLIP
    3.
    发明申请
    HEAT SINK ASSEMBLY HAVING CLIP 失效
    散热器组装有夹子

    公开(公告)号：US20110032680A1

    公开(公告)日：2011-02-10

    申请号：US12632768

    申请日：2009-12-07

    申请人： PIN-QUN ZHAO ,  DONG-BO ZHENG ,  MENG FU ,  CHUN-CHI CHEN

    发明人： PIN-QUN ZHAO ,  DONG-BO ZHENG ,  MENG FU ,  CHUN-CHI CHEN

    IPC分类号： H05K7/20 ,  A44B99/00

    CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  Y10T24/44017 ,  H01L2924/00

    摘要： A clip is adapted for securing a heat sink on a printed circuit board (PCB). The clip includes a linking portion, an operating portion, a handle, and a pressing portion. The linking portion is located at a lateral side of the heat sink. The operating portion pivotally engages with the linking portion and the heat sink. The handle connects the operating portion. The pressing portion connects the linking portion. A fastener mounted on the PCB extends through the heat sink and the pressing portion. The pressing portion is slidable from a first position to a second position. When the pressing portion is in the second position the handle is operable to drive the operating portion to move upwardly and urge the pressing portion to move along the fastener until the pressing portion abuts against a top portion of the fastener and simultaneously presses the heat sink.

    摘要翻译： 夹子适于将散热器固定在印刷电路板（PCB）上。 夹子包括连接部分，操作部分，手柄和按压部分。 连接部分位于散热器的侧面。 操作部分与连接部分和散热器枢转地接合。 手柄连接操作部分。 按压部分连接连接部分。 安装在PCB上的紧固件延伸穿过散热器和按压部分。 按压部分可以从第一位置滑动到第二位置。 当按压部分处于第二位置时，手柄可操作以驱动操作部分向上移动并促使按压部分沿着紧固件移动，直到按压部分抵靠紧固件的顶部并同时按压散热器。

    HEAT DISSIPATION DEVICE WITH HEAT PIPES
    4.
    发明申请
    HEAT DISSIPATION DEVICE WITH HEAT PIPES 有权
    带热管的散热装置

    公开(公告)号：US20090016023A1

    公开(公告)日：2009-01-15

    申请号：US11777034

    申请日：2007-07-12

    申请人： LEI CAO ,  DONG-BO ZHENG ,  MENG FU ,  CHUN-CHI CHEN

    发明人： LEI CAO ,  DONG-BO ZHENG ,  MENG FU ,  CHUN-CHI CHEN

    IPC分类号： H05K7/20

    CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/0275 ,  G06F1/20 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipation device includes a base for contacting an electronic device, a fin set located on the base and first, second heat pipes thermally engaged in the base. The first heat pipe comprises a first transferring portion and two second transferring portions extending from two opposite free ends of the first transferring portion. The second heat pipe has first and second transferring sections. The first transferring section of the second heat pipe is located adjacent to the first transferring portion of the first heat pipe and between the first transferring portion and one of the second transferring portions of the first heat pipe, and the second transferring section of the second heat pipe is located adjacent to the one of the second transferring portions of the first heat pipe.

    摘要翻译： 散热装置包括用于接触电子设备的基座，位于基座上的翅片组和第一热接合在基座中的第二热管。 第一热管包括第一传送部分和从第一传送部分的两个相对的自由端延伸的两个第二传送部分。 第二热管具有第一和第二传送部。 第二热管的第一传送部分位于第一热管的第一传送部分附近并且位于第一传送部分和第一热管的第二传​​送部分之一之间，第二传热部分的第二传热部分 管相邻于第一热管的第二转移部分之一。

    HEAT DISSIPATION DEVICE WITH HEAT PIPE
    5.
    发明申请
    HEAT DISSIPATION DEVICE WITH HEAT PIPE 失效
    热管散热装置

    公开(公告)号：US20080236798A1

    公开(公告)日：2008-10-02

    申请号：US11695462

    申请日：2007-04-02

    申请人： DONG-BO ZHENG ,  LEI CAO ,  MENG FU ,  CHUN-CHI CHEN

    发明人： DONG-BO ZHENG ,  LEI CAO ,  MENG FU ,  CHUN-CHI CHEN

    IPC分类号： H05K7/20

    CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28D15/0275 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipation device includes a base (10) for thermally engaging with an electronic device and a plurality of fins (320) arranged on the base (10). A heat pipe (52) thermally connects the fins (320) and the base (10) for transferring heat from the base (10) to the fins (320). The heat pipe (52) comprises an evaporation section (521) sandwiched between the base (10) and the fins (320), two condensation sections (525, 526) parallel to the evaporation section (521) and thermally engaging with the fins (320), and two connecting sections (527, 528) interconnecting corresponding condensation sections (525, 526) and the evaporation section (521). The connecting sections (527, 528) form an included angle therebetween. The condensation sections (525, 526) are spaced from and extend toward each other.

    摘要翻译： 散热装置包括用于与电子设备热接合的基座（10）和布置在基座（10）上的多个翅片（320）。 热管（52）热连接翅片（320）和底座（10），用于将热量从基座（10）传送到散热片（320）。 热管（52）包括夹在基座（10）和翅片（320）之间的蒸发部分（521），与蒸发部分（521）平行的两个冷凝部分（525,526），并与翅片 320）和互连相应的冷凝部分（525,526）和蒸发部分（521）的两个连接部分（527,528）。 连接部分（527,528）在它们之间形成夹角。 冷凝部分（525,526）彼此间隔开并且彼此延伸。

    HEAT DISSIPATION DEVICE AND CLIP ASSEMBLY THEREOF
    6.
    发明申请
    HEAT DISSIPATION DEVICE AND CLIP ASSEMBLY THEREOF 审中-公开
    散热装置及其组件

    公开(公告)号：US20100314073A1

    公开(公告)日：2010-12-16

    申请号：US12540354

    申请日：2009-08-12

    申请人： PIN-QUN ZHAO ,  DONG-BO ZHENG ,  MENG FU ,  CHUN-CHI CHEN

    发明人： PIN-QUN ZHAO ,  DONG-BO ZHENG ,  MENG FU ,  CHUN-CHI CHEN

    IPC分类号： F28F13/00 ,  A44B21/00

    CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  Y10T24/44034 ,  H01L2924/00

    摘要： A heat dissipation device includes a heat sink, a positioning member and a wire clip. The heat sink includes a base and a plurality of fins. Two of the fins each form a hook. The positioning member includes a seat and two positioning arms each forming two opposite fingers. A receiving groove is defined under the seat, and a positioning slot is defined through a central portion of the seat. The seat is laterally sandwiched between the two fins and vertically sandwiched between the base and the hooks. Each of the two fins is sandwiched between the two fingers. The wire clip includes a resisting portion forming a protrusion and two clipping arms. The resisting portion rests on the base and is received in the receiving groove. The protrusion is received in the positioning slot.

    摘要翻译： 散热装置包括散热器，定位构件和线夹。 散热器包括基座和多个翅片。 两个翅片各形成一个钩子。 定位构件包括座和两个定位臂，每个定位臂形成两个相对的指状物。 接收槽限定在座椅下方，并且定位槽通过座椅的中心部分限定。 座椅横向夹在两个翅片之间，并垂直夹在基座和钩子之间。 两个翅片中的每一个夹在两根手指之间。 线夹包括形成突起的阻挡部分和两个夹持臂。 抵抗部分靠在基座上并被容纳在接收槽中。 突起被接收在定位槽中。

    HEAT DISSIPATION DEVICE
    7.
    发明申请
    HEAT DISSIPATION DEVICE 失效
    散热装置

    公开(公告)号：US20090000768A1

    公开(公告)日：2009-01-01

    申请号：US11769664

    申请日：2007-06-27

    申请人： DONG-BO ZHENG ,  MENG FU ,  CHUN-CHI CHEN

    发明人： DONG-BO ZHENG ,  MENG FU ,  CHUN-CHI CHEN

    IPC分类号： H05K7/20

    CPC分类号： H01L23/427 ,  F28D15/0275 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipation device for at least two heat-generating electronic components, includes a base for contacting with the heat-generating electronic components, a first fin set arranged on one part of the base, a second fin set arranged on another part of the base and at least a heat pipe sandwiched between the base and the first and second fin sets. The first fin set includes a plurality of fins defining a plurality of air passages therebetween. The second fin set includes a plurality of fins. Every two neighboring fins define therebetween an air passage communicating with a corresponding air passage of the first fin set. A channel which is parallel to and has a width larger than that of the air passages of the first and second fin sets is defined in a middle of the second fin set.

    摘要翻译： 一种用于至少两个发热电子部件的散热装置，包括用于与发热电子部件接触的基座，布置在基座的一部分上的第一翅片组，布置在基座的另一部分上的第二翅片组 以及至少夹在基座与第一和第二翅片组之间的热管。 第一翅片组包括在其间限定多个空气通道的多个翅片。 第二翅片组包括多个翅片。 每两个相邻的翅片在其间限定有与第一翅片组的相应空气通道连通的空气通道。 与第一和第二翅片组的空气通道平行并具有宽度的通道限定在第二翅片组的中间。

    HEAT DISSIPATION DEVICE WITH HEAT PIPES
    8.
    发明申请
    HEAT DISSIPATION DEVICE WITH HEAT PIPES 审中-公开
    带热管的散热装置

    公开(公告)号：US20080173430A1

    公开(公告)日：2008-07-24

    申请号：US11626059

    申请日：2007-01-23

    申请人： ZHAO JIN ,  MENG FU ,  CHUN-CHI CHEN

    发明人： ZHAO JIN ,  MENG FU ,  CHUN-CHI CHEN

    IPC分类号： F28D15/00 ,  B32B1/08

    CPC分类号： F28D15/0233 ,  H01L23/427 ,  H01L2023/4081 ,  H01L2924/0002 ,  Y10T428/13 ,  H01L2924/00

    摘要： A heat dissipation device includes a base and a fin set thermally contacting the base. The base has a receiving portion for contacting to and absorbing heat from an electronic device and an extension portion surrounding the receiving portion. A first heat pipe is thermally engaged with the base. The first heat pipe is sinuous and includes a plurality of sections thermally engaged with the extension portion and the receiving portion of the base. A second heat pipe is thermally engaged with the extension portion and the receiving portion of the base. A middle linear section of the first heat pipe and an adjacent linear section of the second heat pipe are mounted to the base and located corresponding to the receiving portion of the base.

    摘要翻译： 散热装置包括底座和与底座热接触的翅片组。 基座具有用于接触和吸收来自电子设备的热量的接收部分和围绕接收部分的延伸部分。 第一热管与基座热接合。 第一热管是弯曲的并且包括与基部的延伸部分和接收部分热接合的多个部分。 第二热管与基座的延伸部分和接收部分热接合。 第一热管的中间线性部分和第二热管的相邻直线部分安装到基部并且对应于基部的接收部分定位。