公开(公告)号：US10255385B2

公开(公告)日：2019-04-09

申请号：US13781474

申请日：2013-02-28

申请人： Stilian Ivanov Pandev ,  Thaddeus Gerard Dziura ,  Meng-Fu Shih ,  Lie-Quan Lee

发明人： Stilian Ivanov Pandev ,  Thaddeus Gerard Dziura ,  Meng-Fu Shih ,  Lie-Quan Lee

IPC分类号： G06F17/50 ,  G03F7/20 ,  G06T7/00 ,  G01N21/47

摘要： Model optimization approaches based on spectral sensitivity is described. For example, a method includes determining a first model of a structure. The first model is based on a first set of parameters. A set of spectral sensitivity variations data is determined for the structure. Spectral sensitivity is determined by derivatives of the spectra with respect to the first set of parameters. The first model of the structure is modified to provide a second model of the structure based on the set of spectral sensitivity variations data. The second model of the structure is based on a second set of parameters different from the first set of parameters. A simulated spectrum derived from the second model of the structure is then provided.

公开(公告)号：US08599156B2

公开(公告)日：2013-12-03

申请号：US13038397

申请日：2011-03-02

申请人： Fu-Yia Hsieh ,  Meng-Fu Hsieh ,  Hsi-Chia Huang ,  Hsin-Yuan Peng ,  Chun-Hua Lee

发明人： Fu-Yia Hsieh ,  Meng-Fu Hsieh ,  Hsi-Chia Huang ,  Hsin-Yuan Peng ,  Chun-Hua Lee

IPC分类号： G06F3/041

CPC分类号： G06F3/0416 ,  G06F3/038

摘要： An electronic apparatus and a method for processing an input signal are provided. In the present invention, a signal conversion module is provided, and the signal conversion module registers into an operating system. A raw data corresponding to an input signal is obtained from the operating system through the signal conversion module, when the input signal is received from a human interface device. And a reference value is obtained from a driver of the human interface device through the signal conversion module. The raw data is converted into a coordinate data according to the reference value through the signal conversion module, and the coordinate data is sent to an application program through the signal conversion module.

摘要翻译： 提供一种用于处理输入信号的电子设备和方法。 在本发明中，提供信号转换模块，信号转换模块登记在操作系统中。 当从人机接口装置接收输入信号时，通过信号转换模块从操作系统获得与输入信号对应的原始数据。 并且通过信号转换模块从人机接口装置的驱动器获得参考值。 原始数据通过信号转换模块根据参考值转换为坐标数据，坐标数据通过信号转换模块发送到应用程序。

公开(公告)号：US20130255929A1

公开(公告)日：2013-10-03

申请号：US13586902

申请日：2012-08-16

申请人： QIAO-LONG CHEN ,  ZI-FU YANG ,  MENG FU ,  CHUN-CHI CHEN

发明人： QIAO-LONG CHEN ,  ZI-FU YANG ,  MENG FU ,  CHUN-CHI CHEN

IPC分类号： F28F7/00 ,  B23P15/26

CPC分类号： H01L23/4006 ,  F28D15/0275 ,  F28F1/32 ,  F28F2275/14 ,  H01L21/4878 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： A heat dissipation device includes a base and a plurality of fins. Two latch parts project from a top surface of the base, the two latch parts cooperatively define a recess therebetween. Each fin defines a tenon at a bottom portion. The tenon has a configuration in complement with that of the recess. The latch parts located between two neighboring fins is punched to make the fins fix on the base.

摘要翻译： 散热装置包括基座和多个翅片。 两个闩锁部件从基座的顶表面突出，两个闩锁部件协作地在它们之间限定凹部。 每个翅片在底部限定榫头。 这个榫头有一个配置与这个凹槽的配合。 位于两个相邻翅片之间的闩锁部件被冲压以使翅片固定在基座上。

公开(公告)号：US20130240190A1

公开(公告)日：2013-09-19

申请号：US13650499

申请日：2012-10-12

申请人： QIAO-LONG CHEN ,  MENG FU ,  ZI-FU YANG ,  CHUN-CHI CHEN

发明人： QIAO-LONG CHEN ,  MENG FU ,  ZI-FU YANG ,  CHUN-CHI CHEN

IPC分类号： F28F3/00 ,  B23P11/00

CPC分类号： B23P15/26 ,  B23P11/00 ,  B23P2700/10 ,  F28F3/048 ,  F28F3/06 ,  F28F2275/122 ,  H01L21/4878 ,  H01L23/3672 ,  H01L2924/0002 ,  Y10T29/49908 ,  H01L2924/00

摘要： An exemplary method for manufacturing a heat sink includes steps: providing a base with a plurality of spaced protrusions formed thereon; providing a plurality of fins and bending a distal end of each fin to form a connecting end; fitting each fin between two adjacent protrusions correspondingly and attaching the connecting end of each fin to the base; and deforming each protrusion to press the connecting ends of two adjacent fins.

摘要翻译： 用于制造散热器的示例性方法包括以下步骤：提供具有在其上形成的多个间隔开的突起的基部; 提供多个翅片并弯曲每个翅片的远端以形成连接端; 将两个相邻突起之间的每个翅片相应地安装，并将每个翅片的连接端连接到基座; 并且使每个突起变形以按压两个相邻翅片的连接端。

公开(公告)号：US08411420B2

公开(公告)日：2013-04-02

申请号：US12914988

申请日：2010-10-28

申请人： Meng Fu ,  Chun-Chi Chen ,  Bang-Jie Xie

发明人： Meng Fu ,  Chun-Chi Chen ,  Bang-Jie Xie

IPC分类号： H05K7/12

CPC分类号： F16M13/00 ,  F16M2200/08 ,  G06F1/1632 ,  H04R5/02

摘要： An electronic device assembly includes an electronic device and a bracket holding the electronic device. The bracket includes a first supporting seat defined a first receiving groove therein and a second supporting seat defined a second receiving groove therein. The first supporting seat is disengagably attachable to the second supporting seat according to either of two selectable arrangements. In a first one of the arrangements, the first receiving groove and the second receiving groove cooperatively define a first receiving chamber having a first width for holding the electronic device in a first orientation. In a second one of the arrangements, the first receiving groove and the second receiving groove cooperatively define a second receiving chamber having a second width for holding the electronic device in a second orientation.

摘要翻译： 电子设备组件包括电子设备和固定电子设备的支架。 托架包括在其中限定第一接收槽的第一支撑座和在其中限定第二接收槽的第二支撑座。 根据两种可选布置中的任一种，第一支撑座可分离地附接到第二支撑座。 在第一种布置中，第一接收槽和第二接收槽协作地限定具有用于将电子设备保持在第一方向的第一宽度的第一接收室。 在第二种布置中，第一接收槽和第二接收槽协作地限定具有用于将电子设备保持在第二方向的第二宽度的第二接收室。

公开(公告)号：US20120318481A1

公开(公告)日：2012-12-20

申请号：US13197775

申请日：2011-08-04

申请人： YUAN YUAN ,  MIN LI ,  MENG FU

发明人： YUAN YUAN ,  MIN LI ,  MENG FU

IPC分类号： F28D15/04

CPC分类号： F28D15/0233 ,  F28D15/0275 ,  G06F1/20 ,  H01L23/3672 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The heat dissipation device includes a first base, a second base placed on the first base, a fin set placed on the second base, a first heat pipe and a second heat pipe. The first heat pipe includes a first evaporating section sandwiched between the first base and the second base, a first condensing section sandwiched between the second base and the fin set, and a first connecting section interconnecting the first evaporating section and the first condensing section. The second heat pipe includes a second evaporating section located adjacent to a bottom end of the fin set, a second condensing section located adjacent to a top end of the fin set, and a second connecting section interconnecting the second evaporating section and the second condensing section.

摘要翻译： 示例性的散热装置适于散发由安装在印刷电路板上的电子部件产生的热量。 散热装置包括第一基座，设置在第一基座上的第二基座，设置在第二基座上的翅片组，第一热管和第二热管。 第一热管包括夹在第一基座和第二基座之间的第一蒸发部分，夹在第二基部和翅片组之间的第一冷凝部以及将第一蒸发部与第一冷凝部互连的第一连接部。 所述第二热管包括邻近所述翅片组的底端定位的第二蒸发部分，与所述翅片组的顶端相邻的第二冷凝部，以及将所述第二蒸发部与所述第二冷凝部相互连接的第二连接部 。

公开(公告)号：US20100259897A1

公开(公告)日：2010-10-14

申请号：US12503021

申请日：2009-07-14

申请人： XU-XIN MIN ,  MENG FU ,  CHUN-CHI CHEN

发明人： XU-XIN MIN ,  MENG FU ,  CHUN-CHI CHEN

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0275 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device dissipates heat generated by a heat-generating electronic element mounted on a top surface printed circuit board. The printed circuit board defines a plurality of first through holes. The heat dissipation device comprises a heat spreader located at a top side of the printed circuit board. The heat spreader defines a plurality of second through holes corresponding to the first through holes, respectively. A first heat sink is located over the heat spreader, and a plurality of second heat sinks is located at a bottom side of the printed circuit board. A plurality of heat pipes extending through the second through holes of the heat spreader and the first through holes of the printed circuit board to thermally connect the first and second heat sinks to the heat spreader.

摘要翻译： 散热装置散发由安装在顶面印刷电路板上的发热电子元件产生的热量。 印刷电路板限定多个第一通孔。 散热装置包括位于印刷电路板顶侧的散热器。 散热器分别限定与第一通孔相对应的多个第二通孔。 第一散热器位于散热器上方，并且多个第二散热器位于印刷电路板的底侧。 多个热管延伸穿过散热器的第二通孔和印刷电路板的第一通孔，以将第一和第二散热器热连接到散热器。

公开(公告)号：US20100116462A1

公开(公告)日：2010-05-13

申请号：US12432739

申请日：2009-04-29

申请人： MENG FU ,  JIE-CHENG DENG ,  CHUN-CHI CHEN

发明人： MENG FU ,  JIE-CHENG DENG ,  CHUN-CHI CHEN

IPC分类号： F28F7/00

CPC分类号： H01L23/467 ,  F28F3/02 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation system comprises a printed circuit board and at least a heat dissipation device mounted on the printed circuit board for dissipating heat generated by an electronic member mounted on the printed circuit board. The at least a heat dissipation device comprises a base, a plurality of fins extending upwardly from the base and an air guiding member located at a corner of the base. These fins are spaced from each other to define a plurality of heat exchange passages. Non-fins are disposed at a side of the base to define a cooling air passage. The cooling air passage is parallel to the heat exchange passages of the fins. The air guiding member is located in the cooling air passage for controlling open and close of the cooling air passage.

摘要翻译： 散热系统包括印刷电路板和至少一个安装在印刷电路板上的用于散发由安装在印刷电路板上的电子部件产生的热量的散热装置。 所述至少一个散热装置包括底座，从底座向上延伸的多个翅片以及位于底座角落处的空气引导构件。 这些翅片彼此间隔开以限定多个热交换通道。 非翅片设置在基座的一侧以限定冷却空气通道。 冷却空气通道平行于翅片的热交换通道。 空气引导构件位于冷却空气通道中，用于控制冷却空气通道的打开和关闭。

公开(公告)号：US20100000715A1

公开(公告)日：2010-01-07

申请号：US12239839

申请日：2008-09-29

申请人： DONG-BO ZHENG ,  MENG FU ,  CHUN-CHI CHEN

发明人： DONG-BO ZHENG ,  MENG FU ,  CHUN-CHI CHEN

IPC分类号： F28F7/00

CPC分类号： H01L23/4006 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a base, a sleeve coupling with the base, and a fastener engaging with the base and the sleeve. The base defines a hole extending therethrough. The sleeve includes a first portion coupling with the hole of the base and a second portion extending from an end of the first portion. The second portion is located at a first side of the base. The fastener includes a body portion extending through the sleeve and the base, a head portion and a foot portion formed at two ends of the body portion, respectively. The head portion is located at the first side of the base. A spring member is compressed between the head portion and the second portion. A compressed length of the spring member is adjustable by adjusting a coupling length of the first portion with the hole of the base.

摘要翻译： 散热装置包括基座，与基座连接的套筒以及与基座和套筒接合的紧固件。 底座限定了一个贯穿其中的孔。 套筒包括与基座的孔结合的第一部分和从第一部分的端部延伸的第二部分。 第二部分位于基部的第一侧。 紧固件包括分别延伸穿过套筒和底座的主体部分，分别形成在主体部分两端的头部部分和脚部部分。 头部位于基座的第一侧。 弹簧构件在头部和第二部分之间被压缩。 通过调节第一部分与基部的孔的联接长度来调节弹簧构件的压缩长度。

公开(公告)号：US07537046B2

公开(公告)日：2009-05-26

申请号：US11695462

申请日：2007-04-02

申请人： Dong-Bo Zheng ,  Lei Cao ,  Meng Fu ,  Chun-Chi Chen

发明人： Dong-Bo Zheng ,  Lei Cao ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： F28D15/00 ,  H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28D15/0275 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a base (10) for thermally engaging with an electronic device and a plurality of fins (320) arranged on the base (10). A heat pipe (52) thermally connects the fins (320) and the base (10) for transferring heat from the base (10) to the fins (320). The heat pipe (52) comprises an evaporation section (521) sandwiched between the base (10) and the fins (320), two condensation sections (525, 526) parallel to the evaporation section (521) and thermally engaging with the fins (320), and two connecting sections (527, 528) interconnecting corresponding condensation sections (525, 526) and the evaporation section (521). The connecting sections (527, 528) form an included angle therebetween. The condensation sections (525, 526) are spaced from and extend toward each other.

摘要翻译： 散热装置包括用于与电子设备热接合的基座（10）和布置在基座（10）上的多个翅片（320）。 热管（52）热连接翅片（320）和底座（10），用于将热量从基座（10）传送到散热片（320）。 热管（52）包括夹在基座（10）和翅片（320）之间的蒸发部分（521），与蒸发部分（521）平行的两个冷凝部分（525,526），并与翅片 320）和互连相应的冷凝部分（525,526）和蒸发部分（521）的两个连接部分（527,528）。 连接部分（527,528）在它们之间形成夹角。 冷凝部分（525,526）彼此间隔开并且彼此延伸。