公开(公告)号：US20120224028A1

公开(公告)日：2012-09-06

申请号：US13407879

申请日：2012-02-29

申请人： DOO CHEOL PARK ,  SEUNG HYUK CHANG ,  MYUNG-SUN KIM ,  WON JOO KIM ,  JU HWAN JUNG ,  SEUNG HOON LEE ,  KWANG-MIN LEE ,  HYOUNG SOO KO

发明人： DOO CHEOL PARK ,  SEUNG HYUK CHANG ,  MYUNG-SUN KIM ,  WON JOO KIM ,  JU HWAN JUNG ,  SEUNG HOON LEE ,  KWANG-MIN LEE ,  HYOUNG SOO KO

IPC分类号： H04N15/00 ,  G03F7/20 ,  G02B13/14 ,  H01J40/14 ,  G02B3/00

CPC分类号： G02B3/0018 ,  G02B3/0056 ,  G02B13/14 ,  G02B23/14 ,  G03F7/40

摘要： A method of fabricating a microlens includes forming layer of photoresist on a substrate, patterning the layer of photoresist, and then reflowing the photoresist pattern. The layer of photoresist is formed by coating the substrate with liquid photoresist whose viscosity is 150 to 250 cp. A depth sensor includes a substrate and photoelectric conversion elements at an upper portion of the substrate, a metal wiring section disposed on the substrate, an array of the microlenses for focusing incident light as beams onto the photoelectric conversion elements and which beams avoid the wirings of the metal wiring section. The depths sensor also includes a layer presenting a flat upper surface on which the microlenses are formed. The layer may be a dedicated planarization layer or an IR filter, interposed between the microlenses and the metal wiring section.

摘要翻译： 制造微透镜的方法包括在衬底上形成光致抗蚀剂层，图案化光致抗蚀剂层，然后回流光致抗蚀剂图案。 通过用粘度为150至250cp的液体光致抗蚀剂涂覆基底来形成光致抗蚀剂层。 深度传感器包括基板和在基板的上部的光电转换元件，设置在基板上的金属布线部分，用于将入射光聚焦到光电转换元件上的微透镜阵列，并且这些光束避免了布线 金属配线部。 深度传感器还包括呈现其上形成有微透镜的平坦上表面的层。 该层可以是介于微透镜和金属布线部之间的专用平坦化层或IR滤光器。