公开(公告)号：US20230309222A1

公开(公告)日：2023-09-28

申请号：US18023546

申请日：2021-10-18

Applicant: DOOSAN CORPORATION

Inventor： Euidock RYU ,  Sungmoon KIM ,  Jinwoo KIM ,  Subyung PARK ,  Dongho CHAE

IPC: H05K1/03 ,  H05K3/28 ,  H05K1/02

CPC classification number: H05K1/0393 ,  H05K3/281 ,  H05K1/0266 ,  H05K2203/0143 ,  H05K2203/1545 ,  H05K2203/166

Abstract: The present invention relates to a method for manufacturing a double access flexible printed circuit board, having excellent mass production and cost-reduction effects by a roll-to-roll (R2R) process throughout the entire process, and a double access flexible printed circuit board manufactured by the method.

公开(公告)号：US20220322536A1

公开(公告)日：2022-10-06

申请号：US17597018

申请日：2020-06-25

Applicant: DOOSAN CORPORATION

Inventor： Sungmoon KIM ,  Jinwoo KIM ,  Sanghwa KIM ,  Euidock RYU ,  Hyungrae ROH

IPC: H05K3/28

Abstract: The present invention relates to a system for manufacturing a composite substrate, the system comprising: a hot-press device which hot-presses a first composite substrate comprising a printed circuit board and a coverlay temporarily attached thereto to form a second composite substrate, and discharges the second substrate therefrom; and a transfer device which transfers the first substrate into the hot press device while regulating the amount of supplied first composite substrates.

公开(公告)号：US20220353999A1

公开(公告)日：2022-11-03

申请号：US17622551

申请日：2020-06-25

Applicant: DOOSAN CORPORATION

Inventor： Sungmoon KIM ,  Jinwoo KIM ,  Sanghwa KIM ,  Euidock RYU ,  Hyungrae ROH

IPC: H05K3/28

Abstract: A system for manufacturing a printed circuit board includes a coverlay supply apparatus configured to supply a coverlay; a printed circuit board supply apparatus configured to supply a printed circuit board; and a pre-bonding apparatus configured to pre-bond the coverlay supplied from the coverlay supply apparatus onto the printed circuit board supplied from the printed circuit board supply apparatus, thereby discharging a first composite board.