公开(公告)号：US20220353999A1

公开(公告)日：2022-11-03

申请号：US17622551

申请日：2020-06-25

Applicant: DOOSAN CORPORATION

Inventor： Sungmoon KIM ,  Jinwoo KIM ,  Sanghwa KIM ,  Euidock RYU ,  Hyungrae ROH

IPC: H05K3/28

Abstract: A system for manufacturing a printed circuit board includes a coverlay supply apparatus configured to supply a coverlay; a printed circuit board supply apparatus configured to supply a printed circuit board; and a pre-bonding apparatus configured to pre-bond the coverlay supplied from the coverlay supply apparatus onto the printed circuit board supplied from the printed circuit board supply apparatus, thereby discharging a first composite board.

公开(公告)号：US20220251433A1

公开(公告)日：2022-08-11

申请号：US17622489

申请日：2020-06-25

Applicant: DOOSAN CORPORATION

Inventor： Sungmoon KIM ,  Kwangseok PARK ,  Inki JEONG ,  Subyung PARK

IPC: C09J163/00 ,  C09J11/04 ,  C09J7/38 ,  H05K3/28

Abstract: An adhesive composition, a coverlay film containing the adhesive composition, and a printed circuit board containing the coverlay film are disclosed. The adhesive composition includes an epoxy resin, a binder resin containing at least one species of rubber, and an inorganic filler. The adhesive composition has a viscosity of at most 8,000 cps.

公开(公告)号：US20230309222A1

公开(公告)日：2023-09-28

申请号：US18023546

申请日：2021-10-18

Applicant: DOOSAN CORPORATION

Inventor： Euidock RYU ,  Sungmoon KIM ,  Jinwoo KIM ,  Subyung PARK ,  Dongho CHAE

IPC: H05K1/03 ,  H05K3/28 ,  H05K1/02

CPC classification number: H05K1/0393 ,  H05K3/281 ,  H05K1/0266 ,  H05K2203/0143 ,  H05K2203/1545 ,  H05K2203/166

Abstract: The present invention relates to a method for manufacturing a double access flexible printed circuit board, having excellent mass production and cost-reduction effects by a roll-to-roll (R2R) process throughout the entire process, and a double access flexible printed circuit board manufactured by the method.

公开(公告)号：US20230049939A1

公开(公告)日：2023-02-16

申请号：US17794064

申请日：2020-12-14

Applicant: DOOSAN CORPORATION

Inventor： Sungmoon KIM ,  Hyungrae ROH ,  Kwangseok PARK ,  Sanghwa KIM

IPC: H05K3/28 ,  B32B37/00 ,  B32B37/06 ,  B32B41/00 ,  B32B38/18 ,  B32B27/28 ,  B32B15/08 ,  B32B15/20 ,  B32B37/20 ,  B65H23/188

Abstract: A laminator is disclosed. The laminator includes a substrate supply part for supplying a substrate on which a metal pattern is formed; a coverlay supply part for supplying a film to which a plurality of coverlays is attached; a heating roller part for bonding the substrate and the film so that the plurality of coverlays respectively covers the metal pattern; a substrate tension adjustment part and a film tension adjustment part; a bonding state image photographing part for measuring an interval between the plurality of coverlays after the substrate and the film are bonded; and an adjustment part for adjusting the substrate tension adjustment part or the film tension adjustment part so that the interval between the plurality of coverlays measured by the bonding state image photographing part maintains a preset allowable interval.

公开(公告)号：US20220322536A1

公开(公告)日：2022-10-06

申请号：US17597018

申请日：2020-06-25

Applicant: DOOSAN CORPORATION

Inventor： Sungmoon KIM ,  Jinwoo KIM ,  Sanghwa KIM ,  Euidock RYU ,  Hyungrae ROH

IPC: H05K3/28

Abstract: The present invention relates to a system for manufacturing a composite substrate, the system comprising: a hot-press device which hot-presses a first composite substrate comprising a printed circuit board and a coverlay temporarily attached thereto to form a second composite substrate, and discharges the second substrate therefrom; and a transfer device which transfers the first substrate into the hot press device while regulating the amount of supplied first composite substrates.