公开(公告)号：US20230309222A1

公开(公告)日：2023-09-28

申请号：US18023546

申请日：2021-10-18

Applicant: DOOSAN CORPORATION

Inventor： Euidock RYU ,  Sungmoon KIM ,  Jinwoo KIM ,  Subyung PARK ,  Dongho CHAE

IPC: H05K1/03 ,  H05K3/28 ,  H05K1/02

CPC classification number: H05K1/0393 ,  H05K3/281 ,  H05K1/0266 ,  H05K2203/0143 ,  H05K2203/1545 ,  H05K2203/166

Abstract: The present invention relates to a method for manufacturing a double access flexible printed circuit board, having excellent mass production and cost-reduction effects by a roll-to-roll (R2R) process throughout the entire process, and a double access flexible printed circuit board manufactured by the method.

公开(公告)号：US20230135423A1

公开(公告)日：2023-05-04

申请号：US17910703

申请日：2021-03-12

Applicant: DOOSAN CORPORATION

Inventor： Kwangseok PARK ,  Euidock RYU ,  Inki JEONG ,  Subyung PARK ,  Dongho CHAE

IPC: C09J163/00 ,  C09J109/02 ,  H05K3/28 ,  C09J7/30

Abstract: An adhesive composition, and a coverlay film and a printed circuit board that include the adhesive composition are disclosed. The adhesive composition includes: (a) an epoxy resin; and (b) a binder resin including epoxidized polybutadiene rubber and at least two kinds of rubber. The adhesive composition can form an adhesive layer superb in terms of adhesiveness, fluidity, filling properties (landfilling), migration resistance, heat resistance, flame retardancy, low elongation, and flexibility.