公开(公告)号：US20230309222A1

公开(公告)日：2023-09-28

申请号：US18023546

申请日：2021-10-18

Applicant: DOOSAN CORPORATION

Inventor： Euidock RYU ,  Sungmoon KIM ,  Jinwoo KIM ,  Subyung PARK ,  Dongho CHAE

IPC: H05K1/03 ,  H05K3/28 ,  H05K1/02

CPC classification number: H05K1/0393 ,  H05K3/281 ,  H05K1/0266 ,  H05K2203/0143 ,  H05K2203/1545 ,  H05K2203/166

Abstract: The present invention relates to a method for manufacturing a double access flexible printed circuit board, having excellent mass production and cost-reduction effects by a roll-to-roll (R2R) process throughout the entire process, and a double access flexible printed circuit board manufactured by the method.

公开(公告)号：US20230135423A1

公开(公告)日：2023-05-04

申请号：US17910703

申请日：2021-03-12

Applicant: DOOSAN CORPORATION

Inventor： Kwangseok PARK ,  Euidock RYU ,  Inki JEONG ,  Subyung PARK ,  Dongho CHAE

IPC: C09J163/00 ,  C09J109/02 ,  H05K3/28 ,  C09J7/30

Abstract: An adhesive composition, and a coverlay film and a printed circuit board that include the adhesive composition are disclosed. The adhesive composition includes: (a) an epoxy resin; and (b) a binder resin including epoxidized polybutadiene rubber and at least two kinds of rubber. The adhesive composition can form an adhesive layer superb in terms of adhesiveness, fluidity, filling properties (landfilling), migration resistance, heat resistance, flame retardancy, low elongation, and flexibility.

公开(公告)号：US20220322536A1

公开(公告)日：2022-10-06

申请号：US17597018

申请日：2020-06-25

Applicant: DOOSAN CORPORATION

Inventor： Sungmoon KIM ,  Jinwoo KIM ,  Sanghwa KIM ,  Euidock RYU ,  Hyungrae ROH

IPC: H05K3/28

Abstract: The present invention relates to a system for manufacturing a composite substrate, the system comprising: a hot-press device which hot-presses a first composite substrate comprising a printed circuit board and a coverlay temporarily attached thereto to form a second composite substrate, and discharges the second substrate therefrom; and a transfer device which transfers the first substrate into the hot press device while regulating the amount of supplied first composite substrates.

公开(公告)号：US20220353999A1

公开(公告)日：2022-11-03

申请号：US17622551

申请日：2020-06-25

Applicant: DOOSAN CORPORATION

Inventor： Sungmoon KIM ,  Jinwoo KIM ,  Sanghwa KIM ,  Euidock RYU ,  Hyungrae ROH

IPC: H05K3/28

Abstract: A system for manufacturing a printed circuit board includes a coverlay supply apparatus configured to supply a coverlay; a printed circuit board supply apparatus configured to supply a printed circuit board; and a pre-bonding apparatus configured to pre-bond the coverlay supplied from the coverlay supply apparatus onto the printed circuit board supplied from the printed circuit board supply apparatus, thereby discharging a first composite board.