摘要:
A solvent-type curable organopolysiloxane composition comprising (A) at least one type of gum-like or liquid organopolysiloxane having a viscosity of not less than 20 mPA·s, a content of the vinyl(CH2═CH—) part of higher alkenyl groups being in a range of 2.0 to 5.0% by mass; (B) an organopolysiloxane having a viscosity of not less than 1,000,000 mPa·s, a content of the vinyl(CH2═CH—) part of alkenyl groups being less than 0.1% by mass; (C) an organohydrogenpolysiloxane; (D) a hydrosilylation reaction catalyst; and (E) an organic solvent. In such a composition, a mass ratio of the component (A) to the component (B) is in a range of 2/8 to 8/2.
摘要:
A releasing laminate comprises a substrate; (A) a silicone release layer on the substrate; and (B) an adhesive layer on (A) the silicone release layer. (A) The silicone release layer is formed by curing a releasing cured film-forming organopolysiloxane composition. The releasing cured film-forming organopolysiloxane composition comprises: (a) an organopolysiloxane having at least two silicon-bonded alkenyl groups in the molecule; (b) an organohydrogenpolysiloxane; and (c) a hydrosilylation reaction catalyst. Component (a) has a tetra(4)mer to eicosa(20)mer cyclic siloxane content less than or equal to 1,000 ppm in terms of mass units. (B) The adhesive layer comprises an aqueous adhesive composition. A method for producing the releasing laminate is also disclosed.
摘要:
A curable organopolysiloxane composition comprising: (A) at least one type of gum-like or liquid organopolysiloxane having a viscosity of not less than 20 mPa·s, a content of the vinyl(CH2═CH—) part of higher alkenyl groups being in a range of 2.0 to 5.0% by mass; (B) an organopolysiloxane resin formed essentially from R13SiO1/2 units and SiO4/2 units, a molar ratio of the R13SiO1/2 units to the SiO4/2 units being from 0.5 to 2.0 and a content of the vinyl(CH2═CH—) part of alkenyl groups being less than 1.0% by mass; (C) an organohydrogenpolysiloxane; (D) a hydrosilylation reaction catalyst; and, optionally, (E) an organic solvent. In such a composition, a mass ratio of the component (A) to the component (B) is in a range of 2/8 to 8/2.
摘要:
The present invention relates to a release film used by being interposed between a molding material and a mold when the molding material is compression molded using the mold in order to form a sealing material or reflective frame material for an optical semiconductor element, or a lens, wherein the release film comprises a silicone-based cured product layer (2) on at least a surface in contact with the molding material; as well as a compression molding method that uses the film; and a compression molding apparatus that uses the film. The release film for the compression molding of molding materials has good workability and has good releasability, and thereby, a compression molding method with which compression molding with good efficiency is possible and a compression molding apparatus with which molding with good efficiency is possible.