公开(公告)号：US20150237899A1

公开(公告)日：2015-08-27

申请号：US14433931

申请日：2012-10-25

Applicant: DOW GLOBAL TECHNOLOGIES LLC

Inventor： Kevin Kai Cao ,  Zheng Yong Yan ,  Eric Shi ,  Susan Shi

IPC: A23L1/22 ,  A23L1/19

CPC classification number: A23L1/22058 ,  A23D7/003 ,  A23D7/0053 ,  A23L9/20 ,  A23L27/80 ,  A23V2002/00

Abstract: A whippable topping composition comprising: (a) water-soluble carbohydrates, (b1) hydrogenated vegetable fat, (b2) optionally milk fat, (c) an emulsifier formulation having an HLBFormulation value of less than 9, (d1) a first hydroxypropyl methylcellulose, (d2) a second hydroxypropyl methylcellulose, (e) protein, (f) optionally a non-protein hydrocolloid stabilizer, and (g) water, wherein the weight ratio of first hydroxypropyl methylcellulose (d1) to second hydroxypropyl methylcellulose (d2) is within the range of from 3:1 to 13:1.

Abstract translation: 一种可打包的顶部组合物，其包含：（a）水溶性碳水化合物，（b1）氢化植物脂肪，（b2）任选的乳脂肪，（c）HLB形态值小于9的乳化剂制剂，（d1）第一羟丙基甲基纤维素 ，（d2）第二羟丙基甲基纤维素，（e）蛋白质，（f）任选的非蛋白质水解胶体稳定剂和（g）水，其中第一羟丙基甲基纤维素（d1）与第二羟丙基甲基纤维素（d2）的重量比为 在3：1至13：1的范围内。

公开(公告)号：US20150249167A1

公开(公告)日：2015-09-03

申请号：US14430957

申请日：2012-10-15

Applicant: DOW GLOBAL TECHNOLOGIES LLC

Inventor： Yong Wen Zhang ,  William Zhuo Wang ,  Susan Shi ,  Jason J. Folkenroth

IPC: H01L31/0224 ,  H01B13/00 ,  H01B13/30 ,  H01B1/22

CPC classification number: H01L31/022425 ,  H01B1/22 ,  H01B13/0016 ,  H01B13/30 ,  Y02E10/50

Abstract: Disclosed is a conductive composition useful for the preparation of electrically conductive structures on a substrate comprising a plurality of metal particles, a plurality of glass particles and a vehicle comprising at least one cellulose derivative and at least one solid organopolysiloxane resin dissolved in a mutual organic solvent. The solid organopolysiloxane resin acts as adhesion promoter and assists in stably dispersing the metal and glass particles to avoid an agglomeration of such particles without degrading the rheological properties. From such conductive compositions uniform well adherent electrically conductive structures essentially free from defects in the form of cracks, bubbles or coarse particulates can be prepared on dielectric or semiconductor substrates such as silicon wafers in an efficient and cost-saving manner e.g. by screen printing, drying and sintering while inducing only low warping of the substrate. These characteristics render said conductive compositions particularly useful for the fabrication of electrodes of a semiconductor solar cell helping to increase the cell conversion efficiency.

Abstract translation: 公开了一种用于在基材上制备导电结构的导电组合物，其包含多个金属颗粒，多个玻璃颗粒和载体，其包含至少一种纤维素衍生物和至少一种溶解在相互有机溶剂中的固体有机聚硅氧烷树脂 。 固体有机聚硅氧烷树脂作为粘合促进剂，有助于稳定地分散金属和玻璃颗粒，以避免这种颗粒的聚集而不降低流变性能。 从这样的导电组合物可以以高效和节省成本的方式在电介质或半导体衬底（例如硅晶片）上制备基本上没有裂纹形式的缺陷，气泡或粗颗粒的良好粘附的导电结构。 通过丝网印刷，干燥和烧结，同时仅引起基底的低翘曲。 这些特征使得所述导电组合物特别适用于制造半导体太阳能电池的电极，有助于提高电池转换效率。