公开(公告)号：US20240059946A1

公开(公告)日：2024-02-22

申请号：US18267830

申请日：2020-12-24

Applicant: DOW GLOBAL TECHNOLOGIES LLC ,  DOW SILICONES CORPORATION

Inventor： Chao HE ,  Dorab BHAGWAGAR ,  Jiguang ZHANG ,  Ling LING ,  Hongyu CHEN ,  Peng WEI ,  Yan ZHENG ,  Chen CHEN

IPC: C09K5/06

CPC classification number: C09K5/06

Abstract: A thermal interface material is provided. The thermal interface material comprises: (A) a polyolefin having at least two hydroxy groups per molecule; (B) at least one thermally conductive filler; (C) a phase change material with a melting point of 25 to 150° C.; and (D) a coupling agent. A content of component (B) is at least 80 mass %, a content of component (C) is 0.01 to 1 mass %, and a content of component (D) is 0.1 to 1 mass %, each based on a total mass of the thermal interface material. The thermal interface material becomes softer as its temperature increases. Meanwhile, the thermal interface material generally does not exhibit pumping-out in electronic devices during power cycling.

公开(公告)号：US20240141112A1

公开(公告)日：2024-05-02

申请号：US18278649

申请日：2021-03-03

Applicant: Chao He ,  Peng WEI ,  Jiguang ZHANG ,  Hongyu CHEN ,  Yan ZHENG ,  Chen CHEN ,  Dorab BHAGWAGAR ,  DOW SILICONES CORPORATION ,  DOW GLOBAL TECHNOLOGIES LLC

Inventor： Chao HE ,  Peng WEI ,  Jiguang ZHANG ,  Hongyu CHEN ,  Yan ZHENG ,  Chen CHEN ,  Dorab BHAGWAGAR

IPC: C08G77/442 ,  C08K3/22 ,  C08L91/06 ,  C09K5/06

CPC classification number: C08G77/442 ,  C08K3/22 ,  C08L91/06 ,  C09K5/063 ,  C08K2003/2227 ,  C08K2201/003

Abstract: Curable polyolefin composition comprising: (A) polyolefin having at least two aliphatic unsaturated bonds per molecule; (B) wax with melting point of 30 to 100° C.; (C) organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (D) catalytic amount of hydrosilylation reaction catalyst, wherein content of component (A) is 20 to 80 mass %, content of component (B) is 10 to 75 mass %, and content of component (C) is 1 to 20 mass %, each based on the total mass of components (A) to (D). The composition can be cured to form a cured product capable of storing and releasing thermal energy, and preventing the wax leaking/pumping out during heat cycling.

公开(公告)号：US20200308404A1

公开(公告)日：2020-10-01

申请号：US16629162

申请日：2017-09-29

Applicant: DOW SILICONES CORPORATION

Inventor： Zhihua LIU ,  Peng WEI ,  Hexiang YAN ,  Yi ZHAO ,  Qi CHEN ,  Junmin ZHU

IPC: C08L83/04 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C08K3/36 ,  C08K3/013 ,  C08G77/00

Abstract: Provided are a composition, a cured polymer material formed from said composition, a method for forming a thermally conductive material on an article and an article having a thermally conductive material. Said thermally conductive material can be formed on an electronic device, and can be peeled off from said electronic device.