公开(公告)号：US20220275206A1

公开(公告)日：2022-09-01

申请号：US17629858

申请日：2019-07-26

Applicant: DOW SILICONES CORPORATION ,  DOW TORAY CO., LTD.

Inventor： Lei FANG ,  Chen CHEN ,  Yan HUANG ,  Masayuki ONISHI ,  Toyohiko FUJISAWA ,  Qi CHEN ,  Guijun YANG

IPC: C08L83/04

Abstract: A curable organopolysiloxane composition is provided. The curable organopolysiloxane composition comprises: (A) an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organosiloxane having one silicon atom-bonded hydrogen atom per molecule and free of alkenyl groups and silicon atom-bonded alkoxy groups; (C) an organosiloxane having one silicon atom-bonded hydrogen atom and at least one silicon atom-bonded alkoxy group per molecule and free of alkenyl groups; (D) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule and free of alkenyl groups and silicon atom-bonded alkoxy groups; (E) a hydrosilylation reaction catalyst; and (F) a condensation reaction catalyst. The curable organopolysiloxane composition can be cured to form a cured product. The cured product generally exhibits an excellent adhesion property against various substrates without cracking and delamination occurring after a thermal shock test.

公开(公告)号：US20220267531A1

公开(公告)日：2022-08-25

申请号：US17620687

申请日：2019-06-21

Applicant: DOW SILICONES CORPORATION ,  DOW TORAY CO., LTD.

Inventor： Debo HONG ,  Xiucuo LI ,  Kazutoshi OKABE ,  Hiroshi ADACHI ,  Lei FANG ,  Qi CHEN

IPC: C08G77/18 ,  C08K3/22 ,  C08K3/36 ,  C08K5/5415 ,  C08K5/544 ,  C08K5/549

Abstract: A method for producing a thixotropic curable silicone composition is provided. The curable silicone composition comprises: (A) a silicone base material comprising: an organopolysiloxane having at least two alkoxysilyl-containing groups per molecule and a filler other than fumed silica; (B) a hydrophobic fumed silica; (C) a carbasilatrane derivative; (D) an alkoxysilane or its partial hydrolysis and condensation product; and (E) a condensation reaction catalyst. The method comprises the following steps: (I) mixing components (A) and (B); (II) mixing component (C) with a mixture obtained by step (I); and (III) mixing components (D) and (E) with a mixture obtained by step (II) under free of moisture. The curable silicone composition obtained by the method has an excellent thixotropic property and can cure at room temperature by contact with moisture in air.

公开(公告)号：US20200308404A1

公开(公告)日：2020-10-01

申请号：US16629162

申请日：2017-09-29

Applicant: DOW SILICONES CORPORATION

Inventor： Zhihua LIU ,  Peng WEI ,  Hexiang YAN ,  Yi ZHAO ,  Qi CHEN ,  Junmin ZHU

IPC: C08L83/04 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C08K3/36 ,  C08K3/013 ,  C08G77/00

Abstract: Provided are a composition, a cured polymer material formed from said composition, a method for forming a thermally conductive material on an article and an article having a thermally conductive material. Said thermally conductive material can be formed on an electronic device, and can be peeled off from said electronic device.