公开(公告)号：US20200308404A1

公开(公告)日：2020-10-01

申请号：US16629162

申请日：2017-09-29

Applicant: DOW SILICONES CORPORATION

Inventor： Zhihua LIU ,  Peng WEI ,  Hexiang YAN ,  Yi ZHAO ,  Qi CHEN ,  Junmin ZHU

IPC: C08L83/04 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C08K3/36 ,  C08K3/013 ,  C08G77/00

Abstract: Provided are a composition, a cured polymer material formed from said composition, a method for forming a thermally conductive material on an article and an article having a thermally conductive material. Said thermally conductive material can be formed on an electronic device, and can be peeled off from said electronic device.