公开(公告)号：US11898065B2

公开(公告)日：2024-02-13

申请号：US17293504

申请日：2019-11-19

申请人： DOW-MITSUI POLYCHEMICALS CO., LTD.

发明人： Koichi Nishijima ,  Hiroaki Machiya ,  Hisao Gonohe ,  Yoshitaka Hironaka

IPC分类号： B32B1/02 ,  C09J123/08 ,  B32B1/00 ,  B32B27/08 ,  B32B27/30 ,  B32B27/32 ,  B65D65/40 ,  C08L23/08 ,  B32B1/08

CPC分类号： C09J123/0869 ,  B32B1/00 ,  B32B27/08 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B65D65/40 ,  C08L23/0869 ,  B32B2250/03 ,  B32B2250/246 ,  B32B2307/31 ,  B32B2439/40 ,  C08L2203/162 ,  C08L2205/03 ,  C08L2205/035 ,  C08L2310/00

摘要： A resin composition for a sealant has excellent heat-sealing strength with respect to a substrate, and a reduced elution amount thereof into normal heptane.
A resin composition for a sealant includes: a resin (A) which is an ethylene-(meth)acrylic acid ester copolymer in which a content of a (meth)acrylic acid ester unit is from 10% by mass to 25% by mass; and a tackifying resin (B), in which a content of the resin (A) is more than 45% by mass with respect to a total amount of resin components in the resin composition for a sealant, and a content of the tackifying resin (B) is from 0.1% by mass to 10% by mass with respect to the total amount of the resin components in the resin composition for a sealant.