-
公开(公告)号：US20230046780A1
公开(公告)日：2023-02-16
申请号：US17790545
申请日：2020-06-10
发明人： Yukiya KATO , Hirotaka KOTANI , Tatsuhiro DOI , Takao TOMIYA , Hiroto NARIEDA
摘要： There is provided a composite plating material and a related technique thereof, the composite plating material including: a base material, and a composite plating layer on the base material, the composite plating layer comprising a composite material containing carbon particles and Sb in an Ag layer, with a carbon content of 6.0 mass % or more and a Sb content of 0.5 mass % or more.
-
2.发明公开公开(公告)号：US20240287699A1
公开(公告)日：2024-08-29
申请号：US18563521
申请日：2022-03-17
发明人： Hirotaka KOTANI , Hiroto NARIEDA , Takao TOMIYA , Tatsuhiro DOI , Yukiya KATO , Hirotaka TAKAHASHI
摘要： There is provided a composite material in which an oxygen-containing silver-based coating layer is formed on a base material. the oxygen-containing silver-based coating layer containing silver and having oxygen present in the vicinity of its surface. and the base material comprising copper or copper alloy.
-
公开(公告)号：US20230175160A1
公开(公告)日：2023-06-08
申请号：US17923692
申请日：2021-04-21
发明人： Yukiya KATO , Hirotaka TAKAHASHI , Tatsuhiro DOI , Hirotaka KOTANI , Takao TOMIYA , Hiroto NARIEDA
摘要： A composite material including a composite film formed on a base material, the composite film including a silver layer containing carbon particles, wherein a content of Sb in the composite film is 1 mass % or less, and a crystallite size of silver in the composite film is 40 nm or less.
-
公开(公告)号：US20180245230A1
公开(公告)日：2018-08-30
申请号：US15752996
申请日：2016-08-23
发明人： Yuta SONODA , Hiroto NARIEDA , Hideki ENDO , Akira SUGAWARA , Hirotaka KOTANI , Jyun TOYOIZUMI , Takaya KANDO , Yuya KISHIBATA
CPC分类号： C25D5/12 , B32B15/01 , B32B2311/12 , B32B2311/16 , B32B2311/22 , C25D3/12 , C25D3/32 , C25D3/38 , C25D5/50 , C25D5/505 , H01R13/03 , H01R43/16
摘要： A tin-plated product contains: a substrate 10 of copper or a copper alloy; an underlying layer 12 of nickel which is formed on the surface of the substrate 10; and an outermost layer 14 containing tin, the outermost layer 14 being formed on the surface of the underlying layer 12, the outermost layer 14 being composed of a copper-tin alloy layer 14a of a large number of crystal grains of a copper-tin alloy, tin layers 14b of tin having an average thickness of 0.01 to 0.20 micrometers, and a plurality of copper-nickel-tin alloy layers 14c of a copper-nickel-tin alloy, each of the tin layers 14b being formed in a corresponding one of recessed portions between adjacent two of the crystal grains of the copper-tin alloy on the outermost surface of the copper-tin alloy layer, the copper-nickel-tin alloy layers 14c being arranged on the side of the underlying layer 12 in the copper-tin alloy layer 14a so as to be apart from each other.
-
-
-
搜索结果
4 条记录 (耗时 0.011 秒)
