公开(公告)号：US20150346002A1

公开(公告)日：2015-12-03

申请号：US14821367

申请日：2015-08-07

申请人： DunAn Sensing LLC

发明人： TOM T. NGUYEN

IPC分类号： G01D11/24 ,  B23P19/04 ,  B23P11/00

CPC分类号： G01D11/245 ,  B23P11/005 ,  B81B7/0032 ,  B81B2201/0264 ,  B81C1/00261 ,  B81C3/00 ,  B81C2203/019 ,  G01D11/26 ,  G01L5/165 ,  G01L19/0672 ,  G01L19/14 ,  G01L19/145 ,  G12B9/06 ,  H01L23/10 ,  Y10T29/49872 ,  Y10T29/49874 ,  Y10T29/49913 ,  Y10T29/49915

摘要： Apparatus and Methods for fabricating apparatus having a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.

摘要翻译： 用于制造装置的设备和方法具有气密密封以密封装置的一部分，例如但不限于具有MEMS传感器的部分。 一种这样的方法使用压接装置来压缩形成在壳体中的空腔中的密封件，该密封件包括附接到应力隔离器的MEMS传感器。 在这种压缩状态下，密封件变形成密封密封应力隔离器内部，外部和底部的表面。

公开(公告)号：US20150343575A1

公开(公告)日：2015-12-03

申请号：US14821459

申请日：2015-08-07

申请人： DunAn Sensing LLC

发明人： TOM T. NGUYEN

IPC分类号： B23P11/00 ,  G01D11/24 ,  G01D11/26 ,  B23P19/04

CPC分类号： G01D11/245 ,  B23P11/005 ,  B81B7/0032 ,  B81B2201/0264 ,  B81C1/00261 ,  B81C1/00325 ,  B81C3/00 ,  B81C3/008 ,  B81C2203/019 ,  G01D11/26 ,  G01L5/165 ,  G01L19/0672 ,  G01L19/14 ,  G01L19/145 ,  G12B9/06 ,  H01L23/10 ,  Y10T29/49872 ,  Y10T29/49874 ,  Y10T29/49913 ,  Y10T29/49915

摘要： Apparatus and Methods for fabricating apparatus having a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.

公开(公告)号：US20170160155A1

公开(公告)日：2017-06-08

申请号：US15434019

申请日：2017-02-15

申请人： DUNAN SENSING, LLC

发明人： TOM T. NGUYEN ,  CUONG D. NGUYEN

IPC分类号： G01L13/02 ,  G01L9/04

CPC分类号： G01L13/025 ,  G01L9/045 ,  G01L9/065

摘要： Compensated pressure sensor includes a MEMS pressure sensor die having resistors RA and RD connected in series in a first leg of a Wheatstone bridge and resistors RB and RC connected in series in a second leg of the Wheatstone bridge; a first and second fuse; and a first, second, third, fourth, fifth and sixth resistor; wherein: a first end of the first resistor is connected in series with the first leg of the bridge and a first end of the second resistor is connected in series with the second leg of the bridge; the first fuse is connected, at a first end, to a first output of the bridge, and at a second end, to a second end of the third resistor and to a first end of the second fuse; the second fuse is connected, at a second end, to a second output of the bridge; a first end of the third resistor is connected to an input to the bridge and to a first end of the fourth resistor; a second end of the fourth resistor is connected to a second end of the first resistor, a second end of the second resistor and a first end of the sixth resistor; and the fifth resistor is connected, at a first end, to the input to the bridge.